DUAL-SIDED MOLDING FOR ENCAPSULATING ELECTRONIC DEVICES

A molding system for molding electronic components mounted on first and second sides of a substrate has a molding cavity onto which the substrate is locatable for molding. The molding cavity has a first section covering a molding portion of the first side of the substrate, and a second section cover...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LIN, Yi, YAN, Kar Weng, KUAH, Teng Hock, PEREZ, Angelito Barrozo
Format: Patent
Sprache:eng
Schlagworte:
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