METHOD FOR MONITORING THE TOTAL AMOUNT OF BRIGHTENERS IN AN ACIDIC COPPER/COPPER ALLOY PLATING BATH AND CONTROLLED PROCESS FOR PLATING

METHOD FOR MONITORING THE TOTAL AMOUNT OF BRIGHTENERS IN AN ACIDIC COPPER/COPPER ALLOY PLATING BATH AND CONTROLLED PROCESS FOR PLATING

The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating process, a controlled process for electrolytically depositing copper...

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Hauptverfasser: MUGLALI, Mutlu-Iskender, VOSS, Torsten, KIRBS, Andreas
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Sprache:eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
METALLURGY
PHYSICS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
TESTING
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creator MUGLALI, Mutlu-Iskender
VOSS, Torsten
KIRBS, Andreas
description The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating process, a controlled process for electrolytically depositing copper/copper alloy onto a substrate utilizing the method for monitoring according to the present invention, and the use of one or more than one redox active compound for monitoring and/or determining the total amount of brighteners in the acidic copper/copper alloy plating bath of.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_PH12018502416A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>PH12018502416A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_PH12018502416A13</originalsourceid><addsrcrecordid>eNqNzb0KwjAUBeAuDqK-wx1cxdY_XNPktgmkuSG9Dk6lSJxEC_UZfG6r9gGEA2f5OGeavCpkTQoKClCRM0zBuBJYIzCxsCAqOjkGKiAPptSMDkMNxoEYIo0yEiR5j2H9KxDW0hm8FfwZygXrgaoBOQ5kLSrwgSTW9fdzdPNkcm1vfVyMPUuWBbLUq9g9mth37SXe47PxOtuk2XGfbnbZQWTbP9kbJjU-yQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR MONITORING THE TOTAL AMOUNT OF BRIGHTENERS IN AN ACIDIC COPPER/COPPER ALLOY PLATING BATH AND CONTROLLED PROCESS FOR PLATING</title><source>esp@cenet</source><creator>MUGLALI, Mutlu-Iskender ; VOSS, Torsten ; KIRBS, Andreas</creator><creatorcontrib>MUGLALI, Mutlu-Iskender ; VOSS, Torsten ; KIRBS, Andreas</creatorcontrib><description>The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating process, a controlled process for electrolytically depositing copper/copper alloy onto a substrate utilizing the method for monitoring according to the present invention, and the use of one or more than one redox active compound for monitoring and/or determining the total amount of brighteners in the acidic copper/copper alloy plating bath of.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; METALLURGY ; PHYSICS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; TESTING</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190311&amp;DB=EPODOC&amp;CC=PH&amp;NR=12018502416A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20190311&amp;DB=EPODOC&amp;CC=PH&amp;NR=12018502416A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MUGLALI, Mutlu-Iskender</creatorcontrib><creatorcontrib>VOSS, Torsten</creatorcontrib><creatorcontrib>KIRBS, Andreas</creatorcontrib><title>METHOD FOR MONITORING THE TOTAL AMOUNT OF BRIGHTENERS IN AN ACIDIC COPPER/COPPER ALLOY PLATING BATH AND CONTROLLED PROCESS FOR PLATING</title><description>The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating process, a controlled process for electrolytically depositing copper/copper alloy onto a substrate utilizing the method for monitoring according to the present invention, and the use of one or more than one redox active compound for monitoring and/or determining the total amount of brighteners in the acidic copper/copper alloy plating bath of.</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>METALLURGY</subject><subject>PHYSICS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzb0KwjAUBeAuDqK-wx1cxdY_XNPktgmkuSG9Dk6lSJxEC_UZfG6r9gGEA2f5OGeavCpkTQoKClCRM0zBuBJYIzCxsCAqOjkGKiAPptSMDkMNxoEYIo0yEiR5j2H9KxDW0hm8FfwZygXrgaoBOQ5kLSrwgSTW9fdzdPNkcm1vfVyMPUuWBbLUq9g9mth37SXe47PxOtuk2XGfbnbZQWTbP9kbJjU-yQ</recordid><startdate>20190311</startdate><enddate>20190311</enddate><creator>MUGLALI, Mutlu-Iskender</creator><creator>VOSS, Torsten</creator><creator>KIRBS, Andreas</creator><scope>EVB</scope></search><sort><creationdate>20190311</creationdate><title>METHOD FOR MONITORING THE TOTAL AMOUNT OF BRIGHTENERS IN AN ACIDIC COPPER/COPPER ALLOY PLATING BATH AND CONTROLLED PROCESS FOR PLATING</title><author>MUGLALI, Mutlu-Iskender ; VOSS, Torsten ; KIRBS, Andreas</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_PH12018502416A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2019</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>METALLURGY</topic><topic>PHYSICS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>MUGLALI, Mutlu-Iskender</creatorcontrib><creatorcontrib>VOSS, Torsten</creatorcontrib><creatorcontrib>KIRBS, Andreas</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MUGLALI, Mutlu-Iskender</au><au>VOSS, Torsten</au><au>KIRBS, Andreas</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MONITORING THE TOTAL AMOUNT OF BRIGHTENERS IN AN ACIDIC COPPER/COPPER ALLOY PLATING BATH AND CONTROLLED PROCESS FOR PLATING</title><date>2019-03-11</date><risdate>2019</risdate><abstract>The present invention relates to a method for monitoring the total amount of brighteners in an acidic copper/copper alloy plating bath during a copper/copper alloy plating process, the use of such a method for controlling a plating process, a controlled process for electrolytically depositing copper/copper alloy onto a substrate utilizing the method for monitoring according to the present invention, and the use of one or more than one redox active compound for monitoring and/or determining the total amount of brighteners in the acidic copper/copper alloy plating bath of.</abstract><oa>free_for_read</oa></addata></record>
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recordid cdi_epo_espacenet_PH12018502416A1
source esp@cenet
subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
METALLURGY
PHYSICS
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
TESTING
title METHOD FOR MONITORING THE TOTAL AMOUNT OF BRIGHTENERS IN AN ACIDIC COPPER/COPPER ALLOY PLATING BATH AND CONTROLLED PROCESS FOR PLATING
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-16T12%3A00%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MUGLALI,%20Mutlu-Iskender&rft.date=2019-03-11&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EPH12018502416A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true