AUTOMATED MULTIPLE HEAD CLEANER FOR A DISPENSING SYSTEM AND RELATED METHOD
A material deposition system is configured to deposit material on an electronic substrate, such as a printed circuit board. The material deposition system includes a frame (20), a support (22) coupled to the frame (20) and configured to support an electronic substrate during a deposit operation, a g...
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creator | TRACY, Robert W MOHANTY, Rita REID, Scott A |
description | A material deposition system is configured to deposit material on an electronic substrate, such as a printed circuit board. The material deposition system includes a frame (20), a support (22) coupled to the frame (20) and configured to support an electronic substrate during a deposit operation, a gantry (24) coupled to the frame (20), and two deposition heads (14, 16) coupled to the gantry (24). Each deposition head includes a needle, with the deposition heads (14, 16) being movable over the support (22) by movement of the gantry (24). The material deposition system further includes a needle cleaner assembly movable on a needle cleaner gantry (24), with the needle cleaner assembly being configured to clean needles of the deposition heads (14, 16). The material deposition system further includes a controller (18) configured to control the operation of the needle cleaner assembly to perform a needle cleaning operation. |
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The material deposition system includes a frame (20), a support (22) coupled to the frame (20) and configured to support an electronic substrate during a deposit operation, a gantry (24) coupled to the frame (20), and two deposition heads (14, 16) coupled to the gantry (24). Each deposition head includes a needle, with the deposition heads (14, 16) being movable over the support (22) by movement of the gantry (24). The material deposition system further includes a needle cleaner assembly movable on a needle cleaner gantry (24), with the needle cleaner assembly being configured to clean needles of the deposition heads (14, 16). The material deposition system further includes a controller (18) configured to control the operation of the needle cleaner assembly to perform a needle cleaning operation.</description><language>eng</language><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; ATOMISING APPARATUS ; NOZZLES ; PERFORMING OPERATIONS ; SPRAYING APPARATUS ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2017</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171018&DB=EPODOC&CC=PH&NR=12017501268A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20171018&DB=EPODOC&CC=PH&NR=12017501268A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TRACY, Robert W</creatorcontrib><creatorcontrib>MOHANTY, Rita</creatorcontrib><creatorcontrib>REID, Scott A</creatorcontrib><title>AUTOMATED MULTIPLE HEAD CLEANER FOR A DISPENSING SYSTEM AND RELATED METHOD</title><description>A material deposition system is configured to deposit material on an electronic substrate, such as a printed circuit board. 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The material deposition system includes a frame (20), a support (22) coupled to the frame (20) and configured to support an electronic substrate during a deposit operation, a gantry (24) coupled to the frame (20), and two deposition heads (14, 16) coupled to the gantry (24). Each deposition head includes a needle, with the deposition heads (14, 16) being movable over the support (22) by movement of the gantry (24). The material deposition system further includes a needle cleaner assembly movable on a needle cleaner gantry (24), with the needle cleaner assembly being configured to clean needles of the deposition heads (14, 16). The material deposition system further includes a controller (18) configured to control the operation of the needle cleaner assembly to perform a needle cleaning operation.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS NOZZLES PERFORMING OPERATIONS SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
title | AUTOMATED MULTIPLE HEAD CLEANER FOR A DISPENSING SYSTEM AND RELATED METHOD |
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