SURFACE TREATED COPPER FOIL, COPPER CLAD LAMINATE, PRINTED WIRING BOARD, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
The present invention provides a treated surface copper foil, which adheres favorably to resin and achieves excellent visibility when observed through the resin. Provided is a treated surface copper foil in which respective surface treatments have been performed on the two surfaces, wherein the colo...
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| creator | ARAI,HIDETA ARAI,KOHSUKE NAKAMURO,KAICHIRO MIKI,ATSUSHI |
| description | The present invention provides a treated surface copper foil, which adheres favorably to resin and achieves excellent visibility when observed through the resin. Provided is a treated surface copper foil in which respective surface treatments have been performed on the two surfaces, wherein the color difference (?E*ab) based on JIS Z8730 of the through-polyimide surface of a copper-clad laminate, configured by laminating treated surface copper foil on a polyimide with a ?B(PI) before bonding to the copper foil of 50 to 65, is at least 50. When the copper foil is photographed with a CCD camera through the polyimide, which has been laminated from the surface on which surface treatment has been performed, ?B (?B = Bt - Bb) in the observation point-brightness graph is at least 40. The ten-point mean roughness (Rz) of TD of the other surface of the treated surface copper foil measured with a laser microscope in which the wavelength of the laser light is 405 nm is at least 0.35 mm. |
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Provided is a treated surface copper foil in which respective surface treatments have been performed on the two surfaces, wherein the color difference (?E*ab) based on JIS Z8730 of the through-polyimide surface of a copper-clad laminate, configured by laminating treated surface copper foil on a polyimide with a ?B(PI) before bonding to the copper foil of 50 to 65, is at least 50. When the copper foil is photographed with a CCD camera through the polyimide, which has been laminated from the surface on which surface treatment has been performed, ?B (?B = Bt - Bb) in the observation point-brightness graph is at least 40. 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Provided is a treated surface copper foil in which respective surface treatments have been performed on the two surfaces, wherein the color difference (?E*ab) based on JIS Z8730 of the through-polyimide surface of a copper-clad laminate, configured by laminating treated surface copper foil on a polyimide with a ?B(PI) before bonding to the copper foil of 50 to 65, is at least 50. When the copper foil is photographed with a CCD camera through the polyimide, which has been laminated from the surface on which surface treatment has been performed, ?B (?B = Bt - Bb) in the observation point-brightness graph is at least 40. 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Provided is a treated surface copper foil in which respective surface treatments have been performed on the two surfaces, wherein the color difference (?E*ab) based on JIS Z8730 of the through-polyimide surface of a copper-clad laminate, configured by laminating treated surface copper foil on a polyimide with a ?B(PI) before bonding to the copper foil of 50 to 65, is at least 50. When the copper foil is photographed with a CCD camera through the polyimide, which has been laminated from the surface on which surface treatment has been performed, ?B (?B = Bt - Bb) in the observation point-brightness graph is at least 40. The ten-point mean roughness (Rz) of TD of the other surface of the treated surface copper foil measured with a laser microscope in which the wavelength of the laser light is 405 nm is at least 0.35 mm.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING |
| title | SURFACE TREATED COPPER FOIL, COPPER CLAD LAMINATE, PRINTED WIRING BOARD, ELECTRONIC APPARATUS AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD |
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