IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS
Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point....
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| creator | PENG WEI XINFENG WANG MING ZHANG HAO ZHOU JIN YANG ERIC D. MCAFEE YINGLEI REN JE-YOUNG CHANG YUAN-LIANG LI GUOLIANG YING PAUL J. GWIN RA'ANAN SOVER CONG ZHOU YUEHONG FAN DAVID SHIA LIGUANG DU JIMMY CHUANG QING JIANG LIANCHANG DU SANDEEP AHUJA LIU YU XICAI JING TIMOTHY GLEN HANNA |
| description | Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. The second chamber includes a second coolant having a second boiling point different that the first boiling point. The second chamber is to separate the electronic component and the second coolant from the first coolant. |
| format | Patent |
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GWIN</au><au>RA'ANAN SOVER</au><au>CONG ZHOU</au><au>YUEHONG FAN</au><au>DAVID SHIA</au><au>LIGUANG DU</au><au>JIMMY CHUANG</au><au>QING JIANG</au><au>LIANCHANG DU</au><au>SANDEEP AHUJA</au><au>LIU YU</au><au>XICAI JING</au><au>TIMOTHY GLEN HANNA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS</title><date>2024-01-05</date><risdate>2024</risdate><abstract>Immersion cooling systems, apparatus, and related methods for cooling electronic computing platforms and/or associated electronic components are disclosed herein. An example apparatus includes a first chamber including a first coolant disposed therein, the first coolant having a first boiling point. The example apparatus further includes a second chamber disposed in the first chamber, the second chamber to receive an electronic component therein. 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| subjects | BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | IMMERSION COOLING SYSTEMS, APPARATUS, AND RELATED METHODS |
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