METHOD FOR REMOVING PHOTOSENSITIVE MATERIAL ON A SUBSTRATE
The present invention provides a method of processing a substrate comprising: providing a substrate with a layer of photosensitive material on a surface of the substrate; and removing photosensitive material from around an outer edge of the layer of photosensitive material, and controlling the remov...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The present invention provides a method of processing a substrate comprising: providing a substrate with a layer of photosensitive material on a surface of the substrate; and removing photosensitive material from around an outer edge of the layer of photosensitive material, and controlling the removing so as to generate an edge, having a radial width, around the layer of photosensitive material remaining on the surface of the substrate, wherein the photosensitive material varies in thickness forming a thickness profile across the radial width and the removing is controlled so as to generate variation in the thickness profile along the length of the edge, and/or wherein the removing is controlled so as to generate a rough edge around the layer of photosensitive material remaining on the surface of the substrate. |
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