Manufacturing method for electronic chip scale package, uses small opening in chip to allow trapped air bubble to vent during encapsulation

Chip Scale Packages - CSPs - have the electronic circuits on a silicon chip (6). Electrical contact with the chip is made via bump contact points (7) under the chip and above the base carrier (4). After assembly, the package is encapsulated in insulating material. In conventional manufacturing syste...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HENDRIKUS JOHANNES BERNARDUS PETERS, WALTER PETER DE MUNNIK
Format:	Patent
Sprache:	dut ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!