WAFER ACCOMMODATION CONTAINER

A wafer accommodation container (1) includes: a container body having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which wafers are stacked, the mount element (12) facing the opening (11); a cover (20) to cover the opening (11); and a co...

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Hauptverfasser: NISHIJIMA Masayuki, HIROSE Kenichi
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creator NISHIJIMA Masayuki
HIROSE Kenichi
description A wafer accommodation container (1) includes: a container body having one end that is provided with an opening (11) and another end that is provided with a mount element (12) on which wafers are stacked, the mount element (12) facing the opening (11); a cover (20) to cover the opening (11); and a connection mechanism (30) to detachably connect the container body (10) and the cover (20), wherein the connection mechanism (30) includes: at least two engagement members (32) each extending from the other end of the container body (10) to the one end of the container body (10) and each having one end that is provided with an engagement nail (31); and at least two engagement holes (33) included in the cover (20) and configured to be each fitted to the corresponding engagement nail (31), and the cover (20) includes guide members (40) each disposed on corresponding one of cover side wall portions (21) and configured to guide the container body (10) and the cover (20) while the guide members (40) are corning into contact with the corresponding engagement members (32) with the container body (10) kept concentric with the cover (20) when the cover (20) is attached to the container body (10). (Figure 6A & 6B)
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(Figure 6A &amp; 6B)</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title WAFER ACCOMMODATION CONTAINER
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