SURFACE TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, LAMINATE, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Disclosed is a surface treated copper foil in which the dropping of the roughening particles from the roughening treatment layer (14) provided on the surface of the copper foil (26) is favorably suppressed. Also disclosed is a surface treated copper foil, comprising a copper foil, a roughening treat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Yuki ORI, Ryo FUKUCHI, Hideta ARAI, Atsushi MIKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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