SURFACE TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, LAMINATE, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Disclosed is a surface treated copper foil in which the dropping of the roughening particles from the roughening treatment layer (14) provided on the surface of the copper foil (26) is favorably suppressed. Also disclosed is a surface treated copper foil, comprising a copper foil, a roughening treat...

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Hauptverfasser:	Yuki ORI, Ryo FUKUCHI, Hideta ARAI, Atsushi MIKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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creator	Yuki ORI Ryo FUKUCHI Hideta ARAI Atsushi MIKI
description	Disclosed is a surface treated copper foil in which the dropping of the roughening particles from the roughening treatment layer (14) provided on the surface of the copper foil (26) is favorably suppressed. Also disclosed is a surface treated copper foil, comprising a copper foil, a roughening treatment layer (14) on one surface, and/or another roughening treatment layer (14) the other surface of the copper foil (26), wherein a height of roughening particles of the roughening treatment layer (14) is 5 to 1000 nm from the surface, a color difference �E*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer (14) is 65 or less, and a glossiness of the TD of the surface of the side of the roughening treatment layer (14) is 70% or less.
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Also disclosed is a surface treated copper foil, comprising a copper foil, a roughening treatment layer (14) on one surface, and/or another roughening treatment layer (14) the other surface of the copper foil (26), wherein a height of roughening particles of the roughening treatment layer (14) is 5 to 1000 nm from the surface, a color difference �Eab according to JIS Z 8730 of a surface of a side of the roughening treatment layer (14) is 65 or less, and a glossiness of the TD of the surface of the side of the roughening treatment layer (14) is 70% or less.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqFjD0KwkAQhdNYiHoFmQOshT-FluPuxAwku2HcGKxCkLUSDcTzeFZXsbARm_f44H1vmDz2laSoCbwQejKgXVmSQOo4V98ANfsMNIowiYIcC7ZRUFCQz5yJG4ECbRXPfCVsd1DGfD3W_MatQzEK0JrfCuWkvTjLGgwdWNM4GZzbSx8mnx4l05S8zmahuzWh79pTuIZ7Uxznm_VqvcDl38ETFjRC8Q</recordid><startdate>20230901</startdate><enddate>20230901</enddate><creator>Yuki ORI</creator><creator>Ryo FUKUCHI</creator><creator>Hideta ARAI</creator><creator>Atsushi MIKI</creator><scope>EVB</scope></search><sort><creationdate>20230901</creationdate><title>SURFACE TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, LAMINATE, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE</title><author>Yuki ORI ; Ryo FUKUCHI ; Hideta ARAI ; Atsushi MIKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_MY198482A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Yuki ORI</creatorcontrib><creatorcontrib>Ryo FUKUCHI</creatorcontrib><creatorcontrib>Hideta ARAI</creatorcontrib><creatorcontrib>Atsushi MIKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Yuki ORI</au><au>Ryo FUKUCHI</au><au>Hideta ARAI</au><au>Atsushi MIKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SURFACE TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, LAMINATE, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE</title><date>2023-09-01</date><risdate>2023</risdate><abstract>Disclosed is a surface treated copper foil in which the dropping of the roughening particles from the roughening treatment layer (14) provided on the surface of the copper foil (26) is favorably suppressed. 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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
title	SURFACE TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, LAMINATE, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
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