SURFACE TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, LAMINATE, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180? C. for 10 days), the peel strengt...
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| creator | Ryo FUKUCHI Hideta ARAI Atsushi MIKI |
| description | Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180? C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable. Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 ?g/dm? or more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 ?g/dm? or less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 ?g/dm? or less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 ?m or less. (Fig. 1) |
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C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable. Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 ?g/dm? or more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 ?g/dm? or less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 ?g/dm? or less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 ?m or less. (Fig. 1)</description><language>eng</language><subject>AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKINGWITHOUT ESSENTIALLY REMOVING MATERIAL ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES,OTHERWISE THAN BY ROLLING ; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PUNCHING METAL ; TRANSPORTING</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230503&DB=EPODOC&CC=MY&NR=196755A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230503&DB=EPODOC&CC=MY&NR=196755A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Ryo FUKUCHI</creatorcontrib><creatorcontrib>Hideta ARAI</creatorcontrib><creatorcontrib>Atsushi MIKI</creatorcontrib><title>SURFACE TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, LAMINATE, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE</title><description>Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180? C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable. Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 ?g/dm? or more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 ?g/dm? or less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 ?g/dm? or less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 ?m or less. 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C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable. Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 ?g/dm? or more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 ?g/dm? or less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 ?g/dm? or less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 ?m or less. (Fig. 1)</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKINGWITHOUT ESSENTIALLY REMOVING MATERIAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES,OTHERWISE THAN BY ROLLING MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL PERFORMING OPERATIONS PRINTED CIRCUITS PUNCHING METAL TRANSPORTING |
| title | SURFACE TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, LAMINATE, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE |
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