PHOTOSENSITIVE RESIN COMPOSITION

Provided is a photosensitive resin composition which exhibits more excellent sensitivity (productivity), resolution and adhesiveness than conventionally used sensitizers in laser direct imaging exposure systems, or the like. A photosensitive resin composition according to the present invention conta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KOSAKA, Junya, OCHIAI, Masahiko, NAITO, Kazuya
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Provided is a photosensitive resin composition which exhibits more excellent sensitivity (productivity), resolution and adhesiveness than conventionally used sensitizers in laser direct imaging exposure systems, or the like. A photosensitive resin composition according to the present invention contains the following components: (A) an alkali-soluble polymer; (B) a compound having an ethylenically unsaturated double bond; (C) a photopolymerization initiator; and (D) a photosensitizer. The photosensitizer (D) contains a distyrylbenzene derivative represented by general formula (2). In general formula (2), each of R3, R4 and R5 represents a cyano group; each of c and e independently represents an integer of 1-5; and d represents an integer of 0-4.