FIRST PROTECTIVE FILM-FORMING SHEET, METHOD FOR FORMING FIRST PROTECTIVE FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

The present invention relates to a first protective film-forming sheet (1) formed by stacking a first pressure-sensitive adhesive layer (13) on a first base material (11) and stacking a curable resin layer (12) on the first pressure-sensitive adhesive layer, in which the curable resin layer is a lay...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YAMAGISHI, MASANORI, SATO, AKINORI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to a first protective film-forming sheet (1) formed by stacking a first pressure-sensitive adhesive layer (13) on a first base material (11) and stacking a curable resin layer (12) on the first pressure-sensitive adhesive layer, in which the curable resin layer is a layer to form a first protective film (12?) on a bump-provided surface of a semiconductor wafer (90) by being attached to the surface and cured, a sum of a thickness of the curable resin layer and a thickness of a first pressure-sensitive adhesive layer is 110 ?m or more, and the thickness of the curable resin layer is 20 ?m to 100 ?m.