CURABLE RESIN FILM AND FIRST PROTECTIVE FILM FORMING SHEET

This curable resin film (12) is attached to a surface (90a) having bumps (91) of a semiconductor wafer (90) and is cured so as to form a first protective film (12?) on the surface, and when the curable resin film is cured by being heated at 160?C for one hour, a yellow index, YI1, after curing is eq...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMAGISHI, MASANORI, SATO, AKINORI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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