CURABLE RESIN FILM AND FIRST PROTECTIVE FILM FORMING SHEET

This curable resin film (12) is attached to a surface (90a) having bumps (91) of a semiconductor wafer (90) and is cured so as to form a first protective film (12?) on the surface, and when the curable resin film is cured by being heated at 160?C for one hour, a yellow index, YI1, after curing is eq...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAGISHI, MASANORI, SATO, AKINORI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	This curable resin film (12) is attached to a surface (90a) having bumps (91) of a semiconductor wafer (90) and is cured so as to form a first protective film (12?) on the surface, and when the curable resin film is cured by being heated at 160?C for one hour, a yellow index, YI1, after curing is equal to or lower than 45, or when the curable resin film is cured by being irradiated with ultraviolet rays under conditions of illuminance of 230 mW/cm2, and light intensity of 510 mJ/cm2, a yellow index, YI2, after curing is equal to or lower than 45. The first protective film forming sheet (1, 2, 3) is provided with a first supporting sheet (101, 102, 103), and the curable resin film is provided on one surface (101a, 102a, 103a) of the first supporting sheet.