ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD
There is provided a roughened copper foil which have not only high adhesion to the resin but also high frictional endurance while having low roughness suitable for forming a fine-pitch circuit and high-frequency applications, resulting in stable high adhesion to the resin even after friction against...
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| creator | TATEOKA Ayumu TSUYOSHI Hiroaki HOSOKAWA Makoto |
| description | There is provided a roughened copper foil which have not only high adhesion to the resin but also high frictional endurance while having low roughness suitable for forming a fine-pitch circuit and high-frequency applications, resulting in stable high adhesion to the resin even after friction against something during the treatment of copper-clad laminates and/or production of printed circuit boards. The roughened copper foil has at least one roughened surface having fine irregularities composed of acicular crystals and/or tabular crystals. The roughened surface has a maximum height Sz of 1.5 ?m or less determined in accordance with ISO 25178 and an arithmetic mean peak curvature Spc determined of 1300 mm-1 or less in accordance with ISO 25178. |
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The roughened copper foil has at least one roughened surface having fine irregularities composed of acicular crystals and/or tabular crystals. The roughened surface has a maximum height Sz of 1.5 ?m or less determined in accordance with ISO 25178 and an arithmetic mean peak curvature Spc determined of 1300 mm-1 or less in accordance with ISO 25178.</description><language>eng</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210722&DB=EPODOC&CC=MY&NR=186397A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25555,76308</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210722&DB=EPODOC&CC=MY&NR=186397A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TATEOKA Ayumu</creatorcontrib><creatorcontrib>TSUYOSHI Hiroaki</creatorcontrib><creatorcontrib>HOSOKAWA Makoto</creatorcontrib><title>ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD</title><description>There is provided a roughened copper foil which have not only high adhesion to the resin but also high frictional endurance while having low roughness suitable for forming a fine-pitch circuit and high-frequency applications, resulting in stable high adhesion to the resin even after friction against something during the treatment of copper-clad laminates and/or production of printed circuit boards. The roughened copper foil has at least one roughened surface having fine irregularities composed of acicular crystals and/or tabular crystals. The roughened surface has a maximum height Sz of 1.5 ?m or less determined in accordance with ISO 25178 and an arithmetic mean peak curvature Spc determined of 1300 mm-1 or less in accordance with ISO 25178.</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAN8g9193D1c3VRcPYPCHANUnDz9_TRgXJ0nX0cXRR8HH09_RxDXHUUHP1cFAKCPP1CgMrDPYEMdwUnf8cgFx4G1rTEnOJUXijNzSDn5hri7KGbWpAfn1pckJicmpdaEu8baWhhZmxp7mhMUAEAWb4qlg</recordid><startdate>20210722</startdate><enddate>20210722</enddate><creator>TATEOKA Ayumu</creator><creator>TSUYOSHI Hiroaki</creator><creator>HOSOKAWA Makoto</creator><scope>EVB</scope></search><sort><creationdate>20210722</creationdate><title>ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD</title><author>TATEOKA Ayumu ; TSUYOSHI Hiroaki ; HOSOKAWA Makoto</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_MY186397A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2021</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TATEOKA Ayumu</creatorcontrib><creatorcontrib>TSUYOSHI Hiroaki</creatorcontrib><creatorcontrib>HOSOKAWA Makoto</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TATEOKA Ayumu</au><au>TSUYOSHI Hiroaki</au><au>HOSOKAWA Makoto</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD</title><date>2021-07-22</date><risdate>2021</risdate><abstract>There is provided a roughened copper foil which have not only high adhesion to the resin but also high frictional endurance while having low roughness suitable for forming a fine-pitch circuit and high-frequency applications, resulting in stable high adhesion to the resin even after friction against something during the treatment of copper-clad laminates and/or production of printed circuit boards. The roughened copper foil has at least one roughened surface having fine irregularities composed of acicular crystals and/or tabular crystals. The roughened surface has a maximum height Sz of 1.5 ?m or less determined in accordance with ISO 25178 and an arithmetic mean peak curvature Spc determined of 1300 mm-1 or less in accordance with ISO 25178.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING |
| title | ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE, AND PRINTED WIRING BOARD |
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