TURRET HANDLERS AND METHODS OF OPERATIONS THEREOF
In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret (120) of a turret handler, transporting the plurality of semiconductor components using the main turret (120) to a test area, and splitting the plurality of se...
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| creator | THENG CHAO LONG NEE WAN KHOO |
| description | In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret (120) of a turret handler, transporting the plurality of semiconductor components using the main turret (120) to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component (1) in the first set at a first test pad (T1a;T2a;T3a;T4a;T5a; ...) using a tester while transporting a second semiconductor component (2) in the second set to a second test pad (T1b; T2b; T3b; T4b; T5b; ...) and testing the second semiconductor component (2) using the tester while transporting the first semiconductor component (1) out of the first test pad (T1a;T2a;T3a;T4a; T5a; ...). The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret. |
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The method further includes testing a first semiconductor component (1) in the first set at a first test pad (T1a;T2a;T3a;T4a;T5a; ...) using a tester while transporting a second semiconductor component (2) in the second set to a second test pad (T1b; T2b; T3b; T4b; T5b; ...) and testing the second semiconductor component (2) using the tester while transporting the first semiconductor component (1) out of the first test pad (T1a;T2a;T3a;T4a; T5a; ...). The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret.</description><language>eng</language><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201020&DB=EPODOC&CC=MY&NR=178812A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201020&DB=EPODOC&CC=MY&NR=178812A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>THENG CHAO LONG</creatorcontrib><creatorcontrib>NEE WAN KHOO</creatorcontrib><title>TURRET HANDLERS AND METHODS OF OPERATIONS THEREOF</title><description>In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret (120) of a turret handler, transporting the plurality of semiconductor components using the main turret (120) to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component (1) in the first set at a first test pad (T1a;T2a;T3a;T4a;T5a; ...) using a tester while transporting a second semiconductor component (2) in the second set to a second test pad (T1b; T2b; T3b; T4b; T5b; ...) and testing the second semiconductor component (2) using the tester while transporting the first semiconductor component (1) out of the first test pad (T1a;T2a;T3a;T4a; T5a; ...). The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAMCQ0Kcg1R8HD0c_FxDQpWANIKvq4hHv4uwQr-bgr-Aa5BjiGe_n7BCiEerkGu_m48DKxpiTnFqbxQmptBzs01xNlDN7UgPz61uCAxOTUvtSTeN9LQ3MLC0MjRmKACAIPFJZY</recordid><startdate>20201020</startdate><enddate>20201020</enddate><creator>THENG CHAO LONG</creator><creator>NEE WAN KHOO</creator><scope>EVB</scope></search><sort><creationdate>20201020</creationdate><title>TURRET HANDLERS AND METHODS OF OPERATIONS THEREOF</title><author>THENG CHAO LONG ; NEE WAN KHOO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_MY178812A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><toplevel>online_resources</toplevel><creatorcontrib>THENG CHAO LONG</creatorcontrib><creatorcontrib>NEE WAN KHOO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>THENG CHAO LONG</au><au>NEE WAN KHOO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>TURRET HANDLERS AND METHODS OF OPERATIONS THEREOF</title><date>2020-10-20</date><risdate>2020</risdate><abstract>In one embodiment, a method of testing a semiconductor component includes loading a plurality of semiconductor components into a main turret (120) of a turret handler, transporting the plurality of semiconductor components using the main turret (120) to a test area, and splitting the plurality of semiconductor components into a first set and a second set. The method further includes testing a first semiconductor component (1) in the first set at a first test pad (T1a;T2a;T3a;T4a;T5a; ...) using a tester while transporting a second semiconductor component (2) in the second set to a second test pad (T1b; T2b; T3b; T4b; T5b; ...) and testing the second semiconductor component (2) using the tester while transporting the first semiconductor component (1) out of the first test pad (T1a;T2a;T3a;T4a; T5a; ...). The first set and the second set are merged into the plurality of semiconductor components and the plurality of semiconductor components are transported away from the test area using the main turret.</abstract><oa>free_for_read</oa></addata></record> |
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| title | TURRET HANDLERS AND METHODS OF OPERATIONS THEREOF |
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