CONTACT BUMP CONNECTION AND CONTACT BUMP AND METHOD FOR PRODUCING A CONTACT BUMP CONNECTION

The invention relates to a contact bump connection (24) and to a method for producing a contact bump connection between an electronic component being provided with at least one terminal face (11) and a contact substrate (26) being contacted with the component and having at least one second terminal...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KRIEBEL, FRANK, NIELAND, CARSTEN
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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