LED LIGHT MODULE
A LIGHT EMITTING MODULE IS DISCLOSED. THE LIGHT EMITTING MODULE (1000) INCLUDES A LEAD FRAME BODY (1010), LEAD FRAME (1020), A HEAT SPREADER (1050), AN INTERMEDIATE HEAT SINK (1090), AND AT LEAST ONE LIGHT EMITTING ELEMENT (1080) (LED). THE LEAD FRAME BODY (1010) DEFINES A CAVITY (1012) WHICH ACCURA...
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| description | A LIGHT EMITTING MODULE IS DISCLOSED. THE LIGHT EMITTING MODULE (1000) INCLUDES A LEAD FRAME BODY (1010), LEAD FRAME (1020), A HEAT SPREADER (1050), AN INTERMEDIATE HEAT SINK (1090), AND AT LEAST ONE LIGHT EMITTING ELEMENT (1080) (LED). THE LEAD FRAME BODY (1010) DEFINES A CAVITY (1012) WHICH ACCURATELY REGISTERS THE HEAT SPREADER (1050) AND INCLUDES OPTICAL OR REFLECTIVE WALLS SURROUNDING THE LIGHT EMITTING ELEMENTS (1080) SOLDERED ON METALLIZED TRACES OF THE HEAT SPREADER (1050). THE LEAD FRAME BODY (1010) ENCASES AND SUPPORTS PORTIONS OF THE LEAD FRAME (1020). THE LEAD FRAME (1020) EXTENDS FROM OUTSIDE THE BODY INTO THE CAVITY TO ACCURATELY ALIGN WITH SOLDER PADS OF THE HEAT SPREADER (1050). ALL THE PRE-ALIGNED MECHANICAL, THERMAL AND ELECTRICAL CONTACTS ARE THEN SOLDERED BY SOLDER REFLOW PROCESS UNDER TIGHT ENVIRONMENTAL CONTROL TO PREVENT DAMAGE TO THE LIGHT EMITTING ELEMENT (1080). A ROBUST, HEALTHY 3-DIMENSIONAL OPTICAL-ELECTRO-MECHANICAL ASSEMBLY HAVING A VERY LOW THERMAL RESISTANCE IN A THERMAL PATH FROM ITS LIGHT EMITTING ELEMENT (1080) TO ITS INTERMEDIATE HEATSINK (1090) IS CREATED. (MOST ILLUSTRATIVE DIAGRAM: |
| format | Patent |
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THE LEAD FRAME BODY (1010) DEFINES A CAVITY (1012) WHICH ACCURATELY REGISTERS THE HEAT SPREADER (1050) AND INCLUDES OPTICAL OR REFLECTIVE WALLS SURROUNDING THE LIGHT EMITTING ELEMENTS (1080) SOLDERED ON METALLIZED TRACES OF THE HEAT SPREADER (1050). THE LEAD FRAME BODY (1010) ENCASES AND SUPPORTS PORTIONS OF THE LEAD FRAME (1020). THE LEAD FRAME (1020) EXTENDS FROM OUTSIDE THE BODY INTO THE CAVITY TO ACCURATELY ALIGN WITH SOLDER PADS OF THE HEAT SPREADER (1050). ALL THE PRE-ALIGNED MECHANICAL, THERMAL AND ELECTRICAL CONTACTS ARE THEN SOLDERED BY SOLDER REFLOW PROCESS UNDER TIGHT ENVIRONMENTAL CONTROL TO PREVENT DAMAGE TO THE LIGHT EMITTING ELEMENT (1080). A ROBUST, HEALTHY 3-DIMENSIONAL OPTICAL-ELECTRO-MECHANICAL ASSEMBLY HAVING A VERY LOW THERMAL RESISTANCE IN A THERMAL PATH FROM ITS LIGHT EMITTING ELEMENT (1080) TO ITS INTERMEDIATE HEATSINK (1090) IS CREATED. (MOST ILLUSTRATIVE DIAGRAM:</description><language>eng</language><subject>BLASTING ; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF ; HEATING ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED ; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR ; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL ; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE ; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS ; LIGHTING ; MECHANICAL ENGINEERING ; NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE ; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR ; WEAPONS</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180517&DB=EPODOC&CC=MY&NR=165834A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20180517&DB=EPODOC&CC=MY&NR=165834A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LOH, BAN P</creatorcontrib><title>LED LIGHT MODULE</title><description>A LIGHT EMITTING MODULE IS DISCLOSED. THE LIGHT EMITTING MODULE (1000) INCLUDES A LEAD FRAME BODY (1010), LEAD FRAME (1020), A HEAT SPREADER (1050), AN INTERMEDIATE HEAT SINK (1090), AND AT LEAST ONE LIGHT EMITTING ELEMENT (1080) (LED). THE LEAD FRAME BODY (1010) DEFINES A CAVITY (1012) WHICH ACCURATELY REGISTERS THE HEAT SPREADER (1050) AND INCLUDES OPTICAL OR REFLECTIVE WALLS SURROUNDING THE LIGHT EMITTING ELEMENTS (1080) SOLDERED ON METALLIZED TRACES OF THE HEAT SPREADER (1050). THE LEAD FRAME BODY (1010) ENCASES AND SUPPORTS PORTIONS OF THE LEAD FRAME (1020). THE LEAD FRAME (1020) EXTENDS FROM OUTSIDE THE BODY INTO THE CAVITY TO ACCURATELY ALIGN WITH SOLDER PADS OF THE HEAT SPREADER (1050). ALL THE PRE-ALIGNED MECHANICAL, THERMAL AND ELECTRICAL CONTACTS ARE THEN SOLDERED BY SOLDER REFLOW PROCESS UNDER TIGHT ENVIRONMENTAL CONTROL TO PREVENT DAMAGE TO THE LIGHT EMITTING ELEMENT (1080). A ROBUST, HEALTHY 3-DIMENSIONAL OPTICAL-ELECTRO-MECHANICAL ASSEMBLY HAVING A VERY LOW THERMAL RESISTANCE IN A THERMAL PATH FROM ITS LIGHT EMITTING ELEMENT (1080) TO ITS INTERMEDIATE HEATSINK (1090) IS CREATED. (MOST ILLUSTRATIVE DIAGRAM:</description><subject>BLASTING</subject><subject>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</subject><subject>HEATING</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED</subject><subject>LIGHT SOURCES NOT OTHERWISE PROVIDED FOR</subject><subject>LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL</subject><subject>LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE</subject><subject>LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE</subject><subject>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBDwcXVR8PF09whR8PV3CfVx5WFgTUvMKU7lhdLcDHJuriHOHrqpBfnxqcUFicmpeakl8b6RhmamFsYmjsYEFQAAT1McRA</recordid><startdate>20180517</startdate><enddate>20180517</enddate><creator>LOH, BAN P</creator><scope>EVB</scope></search><sort><creationdate>20180517</creationdate><title>LED LIGHT MODULE</title><author>LOH, BAN P</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_MY165834A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>BLASTING</topic><topic>FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF</topic><topic>HEATING</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED</topic><topic>LIGHT SOURCES NOT OTHERWISE PROVIDED FOR</topic><topic>LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL</topic><topic>LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE</topic><topic>LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE</topic><topic>STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>LOH, BAN P</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LOH, BAN P</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LED LIGHT MODULE</title><date>2018-05-17</date><risdate>2018</risdate><abstract>A LIGHT EMITTING MODULE IS DISCLOSED. THE LIGHT EMITTING MODULE (1000) INCLUDES A LEAD FRAME BODY (1010), LEAD FRAME (1020), A HEAT SPREADER (1050), AN INTERMEDIATE HEAT SINK (1090), AND AT LEAST ONE LIGHT EMITTING ELEMENT (1080) (LED). THE LEAD FRAME BODY (1010) DEFINES A CAVITY (1012) WHICH ACCURATELY REGISTERS THE HEAT SPREADER (1050) AND INCLUDES OPTICAL OR REFLECTIVE WALLS SURROUNDING THE LIGHT EMITTING ELEMENTS (1080) SOLDERED ON METALLIZED TRACES OF THE HEAT SPREADER (1050). THE LEAD FRAME BODY (1010) ENCASES AND SUPPORTS PORTIONS OF THE LEAD FRAME (1020). THE LEAD FRAME (1020) EXTENDS FROM OUTSIDE THE BODY INTO THE CAVITY TO ACCURATELY ALIGN WITH SOLDER PADS OF THE HEAT SPREADER (1050). ALL THE PRE-ALIGNED MECHANICAL, THERMAL AND ELECTRICAL CONTACTS ARE THEN SOLDERED BY SOLDER REFLOW PROCESS UNDER TIGHT ENVIRONMENTAL CONTROL TO PREVENT DAMAGE TO THE LIGHT EMITTING ELEMENT (1080). A ROBUST, HEALTHY 3-DIMENSIONAL OPTICAL-ELECTRO-MECHANICAL ASSEMBLY HAVING A VERY LOW THERMAL RESISTANCE IN A THERMAL PATH FROM ITS LIGHT EMITTING ELEMENT (1080) TO ITS INTERMEDIATE HEATSINK (1090) IS CREATED. (MOST ILLUSTRATIVE DIAGRAM:</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BLASTING FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF HEATING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21Sand F21V, RELATING TO THEFORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THELIGHT EMITTED LIGHT SOURCES NOT OTHERWISE PROVIDED FOR LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATINGELEMENTS LIGHTING MECHANICAL ENGINEERING NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR WEAPONS |
| title | LED LIGHT MODULE |
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