COPPER FOIL FOR PRINTED CIRCUIT BOARD AND COPPER-CLAD LAMINATE FOR PRINTED CIRCUIT BOARD

A COPPER FOIL FOR A PRINTED CIRCUIT BOARD COMPRISING A LAYER CONTAINING NICKEL, ZINC AND COPPER (HEREINAFTER REFERRED TO AS A "COPPER-NICKEL-ZINC LAYER") ON A SURFACE OF THE COPPER FOIL; WHEREIN A ZINC ADHESION WEIGHT PER UNIT AREA OF THE COPPER-NICKEL-ZINC LAYER, IS 200 PG/DM2 OR MORE AND...

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Bibliographische Detailangaben
Hauptverfasser:	MORIYAMA TERUMASA, ISHII MASAFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	A COPPER FOIL FOR A PRINTED CIRCUIT BOARD COMPRISING A LAYER CONTAINING NICKEL, ZINC AND COPPER (HEREINAFTER REFERRED TO AS A "COPPER-NICKEL-ZINC LAYER") ON A SURFACE OF THE COPPER FOIL; WHEREIN A ZINC ADHESION WEIGHT PER UNIT AREA OF THE COPPER-NICKEL-ZINC LAYER, IS 200 PG/DM2 OR MORE AND 2000 PG/DM2 OR LESS, AND IN THE COPPER-NICKE-ZINC LAYER, NI IS 1 TO 50 MASS%, (ZINC ADHESION AMOUNT (MASS%)) {100 - (COPPER ADHESION AMOUNT (MASS%))} EVALUATES TO 0.3 OR MORE.THIS COPPER FOIL SURFACE TREATMENT TECHNOLOGY IS ABLE TO EFFECTIVELY PREVENT THE CIRCUIT EROSION PHENOMENON IN CASES OF LAMINATING A COPPER FOIL ON A RESIN BASE MATERIAL AND PERFORMING SOFT ETCHING TO THE CIRCUIT WITH A SULFURIC ACID/HYDROGEN PEROXIDE-BASED ETCHING SOLUTION. (FIG. 1)