PHOTOSEMICONDUCTOR ENCAPSULANT OF EPOXY RESIN, ANHYDRIDE AND AROMATIC SILICONE RESIN
AN EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTER ELEMENT ENCAPSULATION, WHICH IS EXCELLENT IN BOTH LIGHT TRANSMISSIBILITY AND LOW STRESS PROPERTY, AS WELL AS LIGHT RESISTANCE AGAINST SHORT WAVELENGTH LIGHT (FOR EXAMPLE, 3.50 TO 500 NM) , IS PROVIDED. THE EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCT...
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| creator | HISATAKA ITO |
| description | AN EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTER ELEMENT ENCAPSULATION, WHICH IS EXCELLENT IN BOTH LIGHT TRANSMISSIBILITY AND LOW STRESS PROPERTY, AS WELL AS LIGHT RESISTANCE AGAINST SHORT WAVELENGTH LIGHT (FOR EXAMPLE, 3.50 TO 500 NM) , IS PROVIDED. THE EPOXY RESIN COMPOSITION FOR PHOTOSEMICONDUCTOR ELEMENT ENCAPSULATION, WHICH COMPRISES THE FOLLOWING COMPONENTS (A) TO (C): (A) AN EPOXY RESIN, (B) AN ACID ANHYDRIDE CURING AGENT, AND (C) A SPECIFIC SILICONE RESIN. |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | PHOTOSEMICONDUCTOR ENCAPSULANT OF EPOXY RESIN, ANHYDRIDE AND AROMATIC SILICONE RESIN |
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