BIPHENYLARALKYL EPOXY AND PHENOLIC RESINS

AN OBJECTIVE OF THIS INVENTION IS TO PROVIDE AN EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR FREE FROM A HARMFUL SUBSTANCE OUT OF REGARD FOR THE ENVIRONMENT, WHICH EXHIBITS EXCELLENT SOLDERING HEAT RESISTANCE AND A HIGHER PRODUCTIVITY, AS WELL AS A SEMICONDUCTOR DEVICE MANUFACTURED BY E...

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Bibliographische Detailangaben
Hauptverfasser:	HIROFUMI KURODA, HIROKI NIKAIDO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING
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Zusammenfassung:	AN OBJECTIVE OF THIS INVENTION IS TO PROVIDE AN EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR FREE FROM A HARMFUL SUBSTANCE OUT OF REGARD FOR THE ENVIRONMENT, WHICH EXHIBITS EXCELLENT SOLDERING HEAT RESISTANCE AND A HIGHER PRODUCTIVITY, AS WELL AS A SEMICONDUCTOR DEVICE MANUFACTURED BY ENCAPSULATING THEREWITH. THIS INVENTION RELATES TO A EPOXY RESIN COMPOSITION FOR ENCAPSULATING A SEMICONDUCTOR COMPRISING, AS ESSENTIAL COMPONENTS, (A) AN EPOXY RESIN HAVING A PARTICULAR STRUCTURE AND (B) APHENOLIC RESIN COMPRISING A PHENOLIC RESIN COMPONENT HAVING A PARTICULAR STRUCTURE AS A MAIN COMPONENT, WHICH CONTAINS A COMPONENT HAVING UP TO THREE AROMATIC RINGS IN ONE MOLECULE IN 0.8 % OR LESS IN AN AREA RATIO AS DETERMINED BY GPC ANALYSIS, AS WELL AS A SEMICONDUCTOR DEVICE MANUFACTURED BY ENCAPSULATING A SEMICONDUCTOR CHIP WITH THE COMPOSITION.