METHOD OF CREATING SOLDER BAR CONNECTIONS ON ELECTRONIC PACKAGES

SOLDER CONNECTIONS ARE CREATED BETWEEN THE SUBSTRATE OF AN ELECTRONIC PACKAGE (10) AND A CIRCUIT BOARD (16) HAVING LENGTHS THAT ARE LONGER THAN THE WIDTH. THE SOLDER CONNECTIONS ARE CREATED BY LOCATING SOLDER BALLS (36A, 36B) OF POWER OR GROUND CONNECTIONS CLOSE ENOUGH TO ONE ANOTHER SO THAT, UPON R...

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Bibliographische Detailangaben

Hauptverfasser:	DISHONGH, TERRANCE, PEARSON, TOM E, AMIR, DUDI I
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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