ABRASIVE ARTICLE HAVING A WINDOW SYSTEM FOR POLISHING WAFERS, AND METHODS
A PROCESS FOR PLANARIZING, POLISHING, OR PROVIDING OTHER MODIFICATION OF A WAFER SURFACE OR OTHER WORKPIECE. THE PROCESS INCLUDES USING AN ABRASIVE ARTICLE HAVING A TEXTURED ABRASAIVE COATING AFFIXED TO A BACKING. THE ABRASIVE ARTICLE INCLUDES A MONITORING ELEMENT, SUCH AS A WINDOW, TO ALLOW TRANSMI...
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creator | MICHAEL JOHN MUILENBURG ROBERT JAMES STREIFEL DANIEL BOONE PENDERGRASS, JR JERRY JOSEPH FIZEL RICHARD JAMES WEBB CHONG-YONG JOHN KIM JOHN JAMES GAGLIARDI WESLEY JAY BRUXVOORT |
description | A PROCESS FOR PLANARIZING, POLISHING, OR PROVIDING OTHER MODIFICATION OF A WAFER SURFACE OR OTHER WORKPIECE. THE PROCESS INCLUDES USING AN ABRASIVE ARTICLE HAVING A TEXTURED ABRASAIVE COATING AFFIXED TO A BACKING. THE ABRASIVE ARTICLE INCLUDES A MONITORING ELEMENT, SUCH AS A WINDOW, TO ALLOW TRANSMISSION OF RADIATION THERETHROUGH. THE RADIATION LEVEL IS MONITORED THROUGHOUT THE PLANARIZATION PROCESS TO DETERMINE THE APPROACH OF THE DESIRED ENDPOINT. THE WINDOW IN THE ABRASIVE COATING CAN BE AN AREA DEVOID OF ABRASIVE COATING OR HAVING MINIMAL OR A THINNED ABRASIVE COATING. |
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subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
title | ABRASIVE ARTICLE HAVING A WINDOW SYSTEM FOR POLISHING WAFERS, AND METHODS |
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