INORGANIC FILLER, EPOXY RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE
BY REMOVING A FRACTION OF FINE PARTICLES HAVING A PARTICLE SIZE OF LESS THAN 2 M FROM STARTING INORGANIC FILLER PARTICLES HAVING A MEAN PARTICLE SIZE OF 10-50 µM AND ADDING THERETO PARTICLES HAVING A MEAN PARTICLE SIZE OF 0.1-2 . µM AND A SPECIFIC SURFACE AREA OF 3-10 M2/G (BET), THERE IS OBTAINED A...
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| creator | KAZUTOSHI TOMIYOSHI EIICHI ASANO TOSHIO SHIOBARA NORIAKI HIGUCHI TAKAAKI FUKUMOTO |
| description | BY REMOVING A FRACTION OF FINE PARTICLES HAVING A PARTICLE SIZE OF LESS THAN 2 M FROM STARTING INORGANIC FILLER PARTICLES HAVING A MEAN PARTICLE SIZE OF 10-50 µM AND ADDING THERETO PARTICLES HAVING A MEAN PARTICLE SIZE OF 0.1-2 . µM AND A SPECIFIC SURFACE AREA OF 3-10 M2/G (BET), THERE IS OBTAINED A PARTICULATE INORGANIC FILLER HAVING A MEAN PARTICLE SIZE OF 5-40 µM. WHEN A LARGE AMOUNT OF THE INORGANIC FILLER IS LOADED IN AN EPOXY RESIN COMPOSITION, THE COMPOSITION MAINTAINS A LOW MELT VISCOSITY ENOUGH TO MOLD AND IS EFFECTIVE FOR ENCAPSULATING A SEMICONDUCTOR DEVICE WITHOUT CAUSING DIE PAD DEFORMATION AND WIRE DEFORMATION. THE ENCAPSULATED SEMICONDUCTOR DEVICE IS HIGHLY RELIABLE. |
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WHEN A LARGE AMOUNT OF THE INORGANIC FILLER IS LOADED IN AN EPOXY RESIN COMPOSITION, THE COMPOSITION MAINTAINS A LOW MELT VISCOSITY ENOUGH TO MOLD AND IS EFFECTIVE FOR ENCAPSULATING A SEMICONDUCTOR DEVICE WITHOUT CAUSING DIE PAD DEFORMATION AND WIRE DEFORMATION. THE ENCAPSULATED SEMICONDUCTOR DEVICE IS HIGHLY RELIABLE.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OFSOLID INORGANIC COMPOUNDS INORGANIC CHEMISTRY LIME, MAGNESIA METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PREPARATION OF CARBON BLACK REFRACTORIES SEMICONDUCTOR DEVICES SLAG TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS THEIR PREPARATION OR CHEMICAL WORKING-UP TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES TREATMENT OF NATURAL STONE USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | INORGANIC FILLER, EPOXY RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE |
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