EDGE BEAD REMOVER FOR THICK FILM PHOTORESISTS
AN EDGE BEAD REMOVER FOR A PHOTORESIST COMPOSITION DISPOSED AS A FILM ON A SURFACE, CONSISTING ESSENTIALLY OF A SOLVENT MIXTURE COMPRISING FROM ABOUT 50 TO ABOUT 80 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF AT LEAST ONE DI (C1-C3)ALKYL CARBONATE AND FROM ABOUT 20 TO ABOUT 50 PA...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | JOSEPH E. OBERLANDER ERNESTO S. SISON CRAIG TRAYNOR JEFF GRIFFIN |
description | AN EDGE BEAD REMOVER FOR A PHOTORESIST COMPOSITION DISPOSED AS A FILM ON A SURFACE, CONSISTING ESSENTIALLY OF A SOLVENT MIXTURE COMPRISING FROM ABOUT 50 TO ABOUT 80 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF AT LEAST ONE DI (C1-C3)ALKYL CARBONATE AND FROM ABOUT 20 TO ABOUT 50 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF CYCLOPENTANONE. A METHOD IS ALSO PROVIDED FOR TREATING A PHOTORESIST COMPOSITION FILM DISPOSED ON A SURFACE WHICH METHOD COMPRISES CONTACTING THE PHOTORESIST COMPOSITION WITH A SOLVENT MIXTURE, IN AN AMOUNT SUFFICIENT TO PRODUCE A SUBSTANTIALLY UNIFORM FILM THICKNESSOF THE PHOTORESIST COMPOSITION ACROSS THE SURFACE, WHEREIN THE SOLVENT MIXTURE COMPRISES FROM ABOUT 50 TO ABOUT 80 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF AT LEAST ONE DI (C1-C3)ALKYL CARBONATE AND FROM ABOUT 20 TO ABOUT 50 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF CYCLOPENTANONE. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_MY118063A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>MY118063A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_MY118063A3</originalsourceid><addsrcrecordid>eNrjZNB1dXF3VXBydXRRCHL19Q9zDVJw8w9SCPHwdPZWcPP08VUI8PAP8Q9yDfYMDgnmYWBNS8wpTuWF0twMcm6uIc4euqkF-fGpxQWJyal5qSXxvpGGhhYGZsaOxgQVAADSsCQ4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EDGE BEAD REMOVER FOR THICK FILM PHOTORESISTS</title><source>esp@cenet</source><creator>JOSEPH E. OBERLANDER ; ERNESTO S. SISON ; CRAIG TRAYNOR ; JEFF GRIFFIN</creator><creatorcontrib>JOSEPH E. OBERLANDER ; ERNESTO S. SISON ; CRAIG TRAYNOR ; JEFF GRIFFIN</creatorcontrib><description>AN EDGE BEAD REMOVER FOR A PHOTORESIST COMPOSITION DISPOSED AS A FILM ON A SURFACE, CONSISTING ESSENTIALLY OF A SOLVENT MIXTURE COMPRISING FROM ABOUT 50 TO ABOUT 80 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF AT LEAST ONE DI (C1-C3)ALKYL CARBONATE AND FROM ABOUT 20 TO ABOUT 50 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF CYCLOPENTANONE. A METHOD IS ALSO PROVIDED FOR TREATING A PHOTORESIST COMPOSITION FILM DISPOSED ON A SURFACE WHICH METHOD COMPRISES CONTACTING THE PHOTORESIST COMPOSITION WITH A SOLVENT MIXTURE, IN AN AMOUNT SUFFICIENT TO PRODUCE A SUBSTANTIALLY UNIFORM FILM THICKNESSOF THE PHOTORESIST COMPOSITION ACROSS THE SURFACE, WHEREIN THE SOLVENT MIXTURE COMPRISES FROM ABOUT 50 TO ABOUT 80 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF AT LEAST ONE DI (C1-C3)ALKYL CARBONATE AND FROM ABOUT 20 TO ABOUT 50 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF CYCLOPENTANONE.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040830&DB=EPODOC&CC=MY&NR=118063A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20040830&DB=EPODOC&CC=MY&NR=118063A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JOSEPH E. OBERLANDER</creatorcontrib><creatorcontrib>ERNESTO S. SISON</creatorcontrib><creatorcontrib>CRAIG TRAYNOR</creatorcontrib><creatorcontrib>JEFF GRIFFIN</creatorcontrib><title>EDGE BEAD REMOVER FOR THICK FILM PHOTORESISTS</title><description>AN EDGE BEAD REMOVER FOR A PHOTORESIST COMPOSITION DISPOSED AS A FILM ON A SURFACE, CONSISTING ESSENTIALLY OF A SOLVENT MIXTURE COMPRISING FROM ABOUT 50 TO ABOUT 80 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF AT LEAST ONE DI (C1-C3)ALKYL CARBONATE AND FROM ABOUT 20 TO ABOUT 50 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF CYCLOPENTANONE. A METHOD IS ALSO PROVIDED FOR TREATING A PHOTORESIST COMPOSITION FILM DISPOSED ON A SURFACE WHICH METHOD COMPRISES CONTACTING THE PHOTORESIST COMPOSITION WITH A SOLVENT MIXTURE, IN AN AMOUNT SUFFICIENT TO PRODUCE A SUBSTANTIALLY UNIFORM FILM THICKNESSOF THE PHOTORESIST COMPOSITION ACROSS THE SURFACE, WHEREIN THE SOLVENT MIXTURE COMPRISES FROM ABOUT 50 TO ABOUT 80 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF AT LEAST ONE DI (C1-C3)ALKYL CARBONATE AND FROM ABOUT 20 TO ABOUT 50 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF CYCLOPENTANONE.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNB1dXF3VXBydXRRCHL19Q9zDVJw8w9SCPHwdPZWcPP08VUI8PAP8Q9yDfYMDgnmYWBNS8wpTuWF0twMcm6uIc4euqkF-fGpxQWJyal5qSXxvpGGhhYGZsaOxgQVAADSsCQ4</recordid><startdate>20040830</startdate><enddate>20040830</enddate><creator>JOSEPH E. OBERLANDER</creator><creator>ERNESTO S. SISON</creator><creator>CRAIG TRAYNOR</creator><creator>JEFF GRIFFIN</creator><scope>EVB</scope></search><sort><creationdate>20040830</creationdate><title>EDGE BEAD REMOVER FOR THICK FILM PHOTORESISTS</title><author>JOSEPH E. OBERLANDER ; ERNESTO S. SISON ; CRAIG TRAYNOR ; JEFF GRIFFIN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_MY118063A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>JOSEPH E. OBERLANDER</creatorcontrib><creatorcontrib>ERNESTO S. SISON</creatorcontrib><creatorcontrib>CRAIG TRAYNOR</creatorcontrib><creatorcontrib>JEFF GRIFFIN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>JOSEPH E. OBERLANDER</au><au>ERNESTO S. SISON</au><au>CRAIG TRAYNOR</au><au>JEFF GRIFFIN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EDGE BEAD REMOVER FOR THICK FILM PHOTORESISTS</title><date>2004-08-30</date><risdate>2004</risdate><abstract>AN EDGE BEAD REMOVER FOR A PHOTORESIST COMPOSITION DISPOSED AS A FILM ON A SURFACE, CONSISTING ESSENTIALLY OF A SOLVENT MIXTURE COMPRISING FROM ABOUT 50 TO ABOUT 80 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF AT LEAST ONE DI (C1-C3)ALKYL CARBONATE AND FROM ABOUT 20 TO ABOUT 50 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF CYCLOPENTANONE. A METHOD IS ALSO PROVIDED FOR TREATING A PHOTORESIST COMPOSITION FILM DISPOSED ON A SURFACE WHICH METHOD COMPRISES CONTACTING THE PHOTORESIST COMPOSITION WITH A SOLVENT MIXTURE, IN AN AMOUNT SUFFICIENT TO PRODUCE A SUBSTANTIALLY UNIFORM FILM THICKNESSOF THE PHOTORESIST COMPOSITION ACROSS THE SURFACE, WHEREIN THE SOLVENT MIXTURE COMPRISES FROM ABOUT 50 TO ABOUT 80 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF AT LEAST ONE DI (C1-C3)ALKYL CARBONATE AND FROM ABOUT 20 TO ABOUT 50 PARTS BY WEIGHT, BASED ON THE WEIGHT OF THE SOLVENT MIXTURE, OF CYCLOPENTANONE.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_epo_espacenet_MY118063A |
source | esp@cenet |
subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
title | EDGE BEAD REMOVER FOR THICK FILM PHOTORESISTS |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-07T06%3A01%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=JOSEPH%20E.%20OBERLANDER&rft.date=2004-08-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EMY118063A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |