PAD ARRAY SEMICONDUCTOR DEVICE WITH THERMAL CONDUCTOR AND PROCESS FOR MAKING THE SAME

A PAD ARRAY SEMICONDUCTOR DEVICE (35) INCLUDES A THERMAL CONDUCTOR (28) INTEGRATED INTO A CIRCUITIZED SUBSTRATE (4). A SEMICONDUCTOR DIE (12) IS MOUNTED ON THE SUBSTRATE OVERLYING THE THERMAL CONDUCTOR TO ESTABLISH A THERMAL PATH AWAY FROM THE DIE. THE THERMAL CONDUCTOR MAY ALSO BE COVERED OR SURROU...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WILSON, HOWARD P, NOMI, VICTOR K, PASTORE, JOHN R
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!