PROCEDIMIENTO MEJORADO PARA PREPARAR UNA ESPUMA FENOLICA Y LA ESPUMA FENOLICA ASI OBTENIDA

An aqueous phenol formaldehyde resole, suitable for use in the manufacture of phenolic foam insulation, has a molar ratio of formaldehyde to phenol in the range of from about 1.7:1 to about 2.3:1, and a weight average molecular weight greater than 800. Preferably, the resole also has a number averag...

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Bibliographische Detailangaben
Hauptverfasser:	JOHN D. CARLSON, JAMES P. COLTON, EDWARD W. KIFER, VINCENT J. WOJTYNA
Format:	Patent
Sprache:	spa
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	An aqueous phenol formaldehyde resole, suitable for use in the manufacture of phenolic foam insulation, has a molar ratio of formaldehyde to phenol in the range of from about 1.7:1 to about 2.3:1, and a weight average molecular weight greater than 800. Preferably, the resole also has a number average molecular weight greater than 350 and a dispersivity greater than about 1.7. Phenol formaldehyde resoles having these characteristics are processable into phenolic foams having these characteristics which make them especially useful as an insulation material. There is also disclosed foamable phenolic resole compositions prepared from the phenolic resoles, and phenolic foams prepared from the compositions.