FORMULATED POLYURETHANE RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES
Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembl...
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| creator | RICHARD DAVID JORDAN, JR THOMAS C. SCANLON, IV |
| description | Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.
Se proporcionan montajes de circuitos electrónicos recubiertos con composiciones poliméricas de recubrimiento aglutinante como se describe o ejemplifica en la presente. La composición de recubrimiento aglutinante se caracteriza por tener suficiente tiempo de gel e índice tixotrópico como para recubrir o encapsular sustancialmente el montaje de circuito eléctrico como una masa fija luego del curado de manera que espesor en superficies horizontales al montaje sea de (0.508 mm) 20 mils a (1.905 mm) 75 mils, y el espesor en superficies de componentes verticales al montaje sea de (0.1016 mm) 4 mils a (0.508 mm) 20 mils. Los montajes recubiertos y los dispositivos que los contienen son ventajosos en comparación con otros materiales de relleno o recubrimientos aislantes ya que requieren menos material y por lo tanto reducen el peso y el costo, y son capaces de soportar condiciones ambientales extremas, ya sean de temperatura y/o vibración. |
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Se proporcionan montajes de circuitos electrónicos recubiertos con composiciones poliméricas de recubrimiento aglutinante como se describe o ejemplifica en la presente. La composición de recubrimiento aglutinante se caracteriza por tener suficiente tiempo de gel e índice tixotrópico como para recubrir o encapsular sustancialmente el montaje de circuito eléctrico como una masa fija luego del curado de manera que espesor en superficies horizontales al montaje sea de (0.508 mm) 20 mils a (1.905 mm) 75 mils, y el espesor en superficies de componentes verticales al montaje sea de (0.1016 mm) 4 mils a (0.508 mm) 20 mils. Los montajes recubiertos y los dispositivos que los contienen son ventajosos en comparación con otros materiales de relleno o recubrimientos aislantes ya que requieren menos material y por lo tanto reducen el peso y el costo, y son capaces de soportar condiciones ambientales extremas, ya sean de temperatura y/o vibración.</description><language>eng ; spa</language><subject>ADHESIVES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; CORRECTING FLUIDS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FILLING PASTES ; INKS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160707&DB=EPODOC&CC=MX&NR=2015016483A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160707&DB=EPODOC&CC=MX&NR=2015016483A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RICHARD DAVID JORDAN, JR</creatorcontrib><creatorcontrib>THOMAS C. SCANLON, IV</creatorcontrib><title>FORMULATED POLYURETHANE RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES</title><description>Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.
Se proporcionan montajes de circuitos electrónicos recubiertos con composiciones poliméricas de recubrimiento aglutinante como se describe o ejemplifica en la presente. La composición de recubrimiento aglutinante se caracteriza por tener suficiente tiempo de gel e índice tixotrópico como para recubrir o encapsular sustancialmente el montaje de circuito eléctrico como una masa fija luego del curado de manera que espesor en superficies horizontales al montaje sea de (0.508 mm) 20 mils a (1.905 mm) 75 mils, y el espesor en superficies de componentes verticales al montaje sea de (0.1016 mm) 4 mils a (0.508 mm) 20 mils. Los montajes recubiertos y los dispositivos que los contienen son ventajosos en comparación con otros materiales de relleno o recubrimientos aislantes ya que requieren menos material y por lo tanto reducen el peso y el costo, y son capaces de soportar condiciones ambientales extremas, ya sean de temperatura y/o vibración.</description><subject>ADHESIVES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FILLING PASTES</subject><subject>INKS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2016</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQgOEuDqK-w-EutFbFNaZXe5DkSnIBdSlF4iRaqO-PHXwApx9-vnl2q9nbaJRgBS2ba_QojXIIHgM50GxbDiTELsBEoTbM1bSVkDsDGtTi2ZEGTV5HElAhoD0ZwrDMZo_-OabVr4tsXaPoZpOGd5fGob-nV_p09rLNi31eHHbHUpV_oS8SRzLl</recordid><startdate>20160707</startdate><enddate>20160707</enddate><creator>RICHARD DAVID JORDAN, JR</creator><creator>THOMAS C. SCANLON, IV</creator><scope>EVB</scope></search><sort><creationdate>20160707</creationdate><title>FORMULATED POLYURETHANE RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES</title><author>RICHARD DAVID JORDAN, JR ; THOMAS C. SCANLON, IV</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_MX2015016483A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; spa</language><creationdate>2016</creationdate><topic>ADHESIVES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FILLING PASTES</topic><topic>INKS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>RICHARD DAVID JORDAN, JR</creatorcontrib><creatorcontrib>THOMAS C. SCANLON, IV</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RICHARD DAVID JORDAN, JR</au><au>THOMAS C. SCANLON, IV</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FORMULATED POLYURETHANE RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES</title><date>2016-07-07</date><risdate>2016</risdate><abstract>Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.
Se proporcionan montajes de circuitos electrónicos recubiertos con composiciones poliméricas de recubrimiento aglutinante como se describe o ejemplifica en la presente. La composición de recubrimiento aglutinante se caracteriza por tener suficiente tiempo de gel e índice tixotrópico como para recubrir o encapsular sustancialmente el montaje de circuito eléctrico como una masa fija luego del curado de manera que espesor en superficies horizontales al montaje sea de (0.508 mm) 20 mils a (1.905 mm) 75 mils, y el espesor en superficies de componentes verticales al montaje sea de (0.1016 mm) 4 mils a (0.508 mm) 20 mils. Los montajes recubiertos y los dispositivos que los contienen son ventajosos en comparación con otros materiales de relleno o recubrimientos aislantes ya que requieren menos material y por lo tanto reducen el peso y el costo, y son capaces de soportar condiciones ambientales extremas, ya sean de temperatura y/o vibración.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS |
| title | FORMULATED POLYURETHANE RESIN COMPOSITIONS FOR FLOOD COATING ELECTRONIC CIRCUIT ASSEMBLIES |
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