SEMICONDUCTOR PACKAGE, A HOLDER, A METHOD FOR PRODUCING AND TESTING FOR THE SAME

A carrier 41 for a semiconductor device which comprises a plurality of leads (225) respectively made up of an inner lead (5, 93a, 225a) and an outer lead (8, 93b, 225b), a semiconductor chip (4, 223) electrically connected to the inner leads of the leads, and a package (7, 221) encapsulating at leas...

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Bibliographische Detailangaben

Hauptverfasser:	KASAI, JUNICHI, SAIGO, YUKIO, YONETA, YOSHIYUKI, TSUJI, KAZUTO, TANIGUCHI, NORIO, MASHIGO, DAKASHI, SAKUMA, MASAO, TAKENAKA, MASASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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