COB TYPE PACKAGE AND MANUFACTURE METHOD

COB TYPE PACKAGE AND MANUFACTURE METHOD

The package includes a dam whose surface is formulated as a rough oxide copper film on a PCB for involving a contacting pads to the inner and the package prevents the separating of a resin layer due to the adhesion of the resin layer and the oxide copper film as the boundary of the resin layer is fo...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: KWON, YOUNG - SIN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The package includes a dam whose surface is formulated as a rough oxide copper film on a PCB for involving a contacting pads to the inner and the package prevents the separating of a resin layer due to the adhesion of the resin layer and the oxide copper film as the boundary of the resin layer is formulated to cover the dam.