SUBSTRATE PROCESSING APPARATUS
본 발명은 기판의 수율을 향상시키는 것이다. 실시 형태에 따른 기판 처리 장치는, 액량 검출부와, 피복 상태 검출부를 구비한다. 액량 검출부는, 기판 상에 형성된 액막의 액량을 검출한다. 피복 상태 검출부는, 액막에 의한 기판의 피복 상태를 검출한다. There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a...
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| creator | OKAMURA SATOSHI OOKAWA KATSUHIRO GOSHO MASATAKA BIWA SATOSHI DOUKI YUICHI KUNUGIMOTO YUICHIRO |
| description | 본 발명은 기판의 수율을 향상시키는 것이다. 실시 형태에 따른 기판 처리 장치는, 액량 검출부와, 피복 상태 검출부를 구비한다. 액량 검출부는, 기판 상에 형성된 액막의 액량을 검출한다. 피복 상태 검출부는, 액막에 의한 기판의 피복 상태를 검출한다.
There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20240163566A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20240163566A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20240163566A3</originalsourceid><addsrcrecordid>eNrjZJALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUknjvICMDIxMDQzNjUzMzR2PiVAEAXOAikg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE PROCESSING APPARATUS</title><source>esp@cenet</source><creator>OKAMURA SATOSHI ; OOKAWA KATSUHIRO ; GOSHO MASATAKA ; BIWA SATOSHI ; DOUKI YUICHI ; KUNUGIMOTO YUICHIRO</creator><creatorcontrib>OKAMURA SATOSHI ; OOKAWA KATSUHIRO ; GOSHO MASATAKA ; BIWA SATOSHI ; DOUKI YUICHI ; KUNUGIMOTO YUICHIRO</creatorcontrib><description>본 발명은 기판의 수율을 향상시키는 것이다. 실시 형태에 따른 기판 처리 장치는, 액량 검출부와, 피복 상태 검출부를 구비한다. 액량 검출부는, 기판 상에 형성된 액막의 액량을 검출한다. 피복 상태 검출부는, 액막에 의한 기판의 피복 상태를 검출한다.
There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241119&DB=EPODOC&CC=KR&NR=20240163566A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241119&DB=EPODOC&CC=KR&NR=20240163566A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKAMURA SATOSHI</creatorcontrib><creatorcontrib>OOKAWA KATSUHIRO</creatorcontrib><creatorcontrib>GOSHO MASATAKA</creatorcontrib><creatorcontrib>BIWA SATOSHI</creatorcontrib><creatorcontrib>DOUKI YUICHI</creatorcontrib><creatorcontrib>KUNUGIMOTO YUICHIRO</creatorcontrib><title>SUBSTRATE PROCESSING APPARATUS</title><description>본 발명은 기판의 수율을 향상시키는 것이다. 실시 형태에 따른 기판 처리 장치는, 액량 검출부와, 피복 상태 검출부를 구비한다. 액량 검출부는, 기판 상에 형성된 액막의 액량을 검출한다. 피복 상태 검출부는, 액막에 의한 기판의 피복 상태를 검출한다.
There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJALDnUKDglyDHFVCAjyd3YNDvb0c1dwDAhwBIqFBvMwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUknjvICMDIxMDQzNjUzMzR2PiVAEAXOAikg</recordid><startdate>20241119</startdate><enddate>20241119</enddate><creator>OKAMURA SATOSHI</creator><creator>OOKAWA KATSUHIRO</creator><creator>GOSHO MASATAKA</creator><creator>BIWA SATOSHI</creator><creator>DOUKI YUICHI</creator><creator>KUNUGIMOTO YUICHIRO</creator><scope>EVB</scope></search><sort><creationdate>20241119</creationdate><title>SUBSTRATE PROCESSING APPARATUS</title><author>OKAMURA SATOSHI ; OOKAWA KATSUHIRO ; GOSHO MASATAKA ; BIWA SATOSHI ; DOUKI YUICHI ; KUNUGIMOTO YUICHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240163566A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>OKAMURA SATOSHI</creatorcontrib><creatorcontrib>OOKAWA KATSUHIRO</creatorcontrib><creatorcontrib>GOSHO MASATAKA</creatorcontrib><creatorcontrib>BIWA SATOSHI</creatorcontrib><creatorcontrib>DOUKI YUICHI</creatorcontrib><creatorcontrib>KUNUGIMOTO YUICHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OKAMURA SATOSHI</au><au>OOKAWA KATSUHIRO</au><au>GOSHO MASATAKA</au><au>BIWA SATOSHI</au><au>DOUKI YUICHI</au><au>KUNUGIMOTO YUICHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE PROCESSING APPARATUS</title><date>2024-11-19</date><risdate>2024</risdate><abstract>본 발명은 기판의 수율을 향상시키는 것이다. 실시 형태에 따른 기판 처리 장치는, 액량 검출부와, 피복 상태 검출부를 구비한다. 액량 검출부는, 기판 상에 형성된 액막의 액량을 검출한다. 피복 상태 검출부는, 액막에 의한 기판의 피복 상태를 검출한다.
There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.</abstract><oa>free_for_read</oa></addata></record> |
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| title | SUBSTRATE PROCESSING APPARATUS |
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