APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

본 발명의 일 실시예에 의하면, 기판 처리 장치는, 기판을 지지하는 서셉터; 그리고 상기 서셉터의 상부에 설치되어 상부에 상기 기판이 놓여지는 커버 유닛을 포함하되, 상기 커버 유닛은, 하나 이상의 에어 갭을 가지는 커버프레임; 그리고 각각의 상기 에어 갭에 대응되는 형상을 가지고 각각의 상기 에어 갭에 실장가능한 하나 이상의 커버를 구비한다. According to an embodiment of the present invention, an apparatus for processing substrate comprising: a s...

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Hauptverfasser: JUNG, SANG SOON, SUNG, SE JONG, HWANG, RYONG, JUNG, WOO DUCK, JO, JEONG HEE, JANG, WOONG JOO
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Sprache:eng ; kor
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creator JUNG, SANG SOON
SUNG, SE JONG
HWANG, RYONG
JUNG, WOO DUCK
JO, JEONG HEE
JANG, WOONG JOO
description 본 발명의 일 실시예에 의하면, 기판 처리 장치는, 기판을 지지하는 서셉터; 그리고 상기 서셉터의 상부에 설치되어 상부에 상기 기판이 놓여지는 커버 유닛을 포함하되, 상기 커버 유닛은, 하나 이상의 에어 갭을 가지는 커버프레임; 그리고 각각의 상기 에어 갭에 대응되는 형상을 가지고 각각의 상기 에어 갭에 실장가능한 하나 이상의 커버를 구비한다. According to an embodiment of the present invention, an apparatus for processing substrate comprising: a susceptor; and a cover unit installed on an upper part of the susceptor, the substrate is placed on the cover unit, wherein the cover unit comprises: a cover frame having one or more air gaps; and one or more covers having a shape corresponding to each of the air gaps and mountable in each of the air gaps, wherein a depth of the air gap is at least three times the thickness of the substrate.
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According to an embodiment of the present invention, an apparatus for processing substrate comprising: a susceptor; and a cover unit installed on an upper part of the susceptor, the substrate is placed on the cover unit, wherein the cover unit comprises: a cover frame having one or more air gaps; and one or more covers having a shape corresponding to each of the air gaps and mountable in each of the air gaps, wherein a depth of the air gap is at least three times the thickness of the substrate.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241118&amp;DB=EPODOC&amp;CC=KR&amp;NR=20240163031A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20241118&amp;DB=EPODOC&amp;CC=KR&amp;NR=20240163031A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>JUNG, SANG SOON</creatorcontrib><creatorcontrib>SUNG, SE JONG</creatorcontrib><creatorcontrib>HWANG, RYONG</creatorcontrib><creatorcontrib>JUNG, WOO DUCK</creatorcontrib><creatorcontrib>JO, JEONG HEE</creatorcontrib><creatorcontrib>JANG, WOONG JOO</creatorcontrib><title>APPARATUS AND METHOD FOR PROCESSING SUBSTRATE</title><description>본 발명의 일 실시예에 의하면, 기판 처리 장치는, 기판을 지지하는 서셉터; 그리고 상기 서셉터의 상부에 설치되어 상부에 상기 기판이 놓여지는 커버 유닛을 포함하되, 상기 커버 유닛은, 하나 이상의 에어 갭을 가지는 커버프레임; 그리고 각각의 상기 에어 갭에 대응되는 형상을 가지고 각각의 상기 에어 갭에 실장가능한 하나 이상의 커버를 구비한다. 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According to an embodiment of the present invention, an apparatus for processing substrate comprising: a susceptor; and a cover unit installed on an upper part of the susceptor, the substrate is placed on the cover unit, wherein the cover unit comprises: a cover frame having one or more air gaps; and one or more covers having a shape corresponding to each of the air gaps and mountable in each of the air gaps, wherein a depth of the air gap is at least three times the thickness of the substrate.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
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