에폭시 수지 조성물, 금속 표면 처리용 조성물, 금속 적층판의 제조 방법, 및 금속판의 접착 방법
본 개시는 (A) 에폭시 수지, (B) 아미노실란계 화합물, (C) 카르보디이미드 화합물, 이소시아네이트계 화합물, 폴리에테르아민계 화합물, 인산 변성 에폭시 수지, 멜라민 수지, 및 페놀 수지로 이루어지는 군에서 선택되는 1 종 또는 2 종 이상인 가교제, 및 (D) 물을 함유하는, 에폭시 수지 조성물, 그 에폭시 수지 조성물을 포함하는 금속 표면 처리용 조성물, 금속판의 제조 방법, 및 금속판의 접착 방법을 제공한다. The present disclosure provides: an epoxy resin composition th...
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| creator | OOSATO TAKUTO ENDO HIROTAKA NAKATSUJI AKIRA |
| description | 본 개시는 (A) 에폭시 수지, (B) 아미노실란계 화합물, (C) 카르보디이미드 화합물, 이소시아네이트계 화합물, 폴리에테르아민계 화합물, 인산 변성 에폭시 수지, 멜라민 수지, 및 페놀 수지로 이루어지는 군에서 선택되는 1 종 또는 2 종 이상인 가교제, 및 (D) 물을 함유하는, 에폭시 수지 조성물, 그 에폭시 수지 조성물을 포함하는 금속 표면 처리용 조성물, 금속판의 제조 방법, 및 금속판의 접착 방법을 제공한다.
The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide compound, an isocyanate-based compound, a polyetheramine-based compound, a phosphoric acid-modified epoxy resin, a melamine resin and a phenolic resin, and (D) water; a composition for metal surface processing, which contains said epoxy resin composition; a method for producing a metal sheet; and a method for bonding a metal sheet. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_KR20240159882A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>KR20240159882A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_KR20240159882A3</originalsourceid><addsrcrecordid>eNrjZGh4M33C2_61b7rnKLzpmPFmeYPCm4Ub3rRsfL1mj47Cqx0db9p6Fd5OnPN65RaFN5tmvF625s2slViUvFnQ-GbH1rc9E97MnQHkzAGqUHi9YeXrTVN1gHQ_VBlcfuKbDSuh8jwMrGmJOcWpvFCam0HZzTXE2UM3tSA_PrW4IDE5NS-1JN47yMjAyMTA0NTSwsLI0Zg4VQBi-Gx_</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>에폭시 수지 조성물, 금속 표면 처리용 조성물, 금속 적층판의 제조 방법, 및 금속판의 접착 방법</title><source>esp@cenet</source><creator>OOSATO TAKUTO ; ENDO HIROTAKA ; NAKATSUJI AKIRA</creator><creatorcontrib>OOSATO TAKUTO ; ENDO HIROTAKA ; NAKATSUJI AKIRA</creatorcontrib><description>본 개시는 (A) 에폭시 수지, (B) 아미노실란계 화합물, (C) 카르보디이미드 화합물, 이소시아네이트계 화합물, 폴리에테르아민계 화합물, 인산 변성 에폭시 수지, 멜라민 수지, 및 페놀 수지로 이루어지는 군에서 선택되는 1 종 또는 2 종 이상인 가교제, 및 (D) 물을 함유하는, 에폭시 수지 조성물, 그 에폭시 수지 조성물을 포함하는 금속 표면 처리용 조성물, 금속판의 제조 방법, 및 금속판의 접착 방법을 제공한다.
The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide compound, an isocyanate-based compound, a polyetheramine-based compound, a phosphoric acid-modified epoxy resin, a melamine resin and a phenolic resin, and (D) water; a composition for metal surface processing, which contains said epoxy resin composition; a method for producing a metal sheet; and a method for bonding a metal sheet.</description><language>kor</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMICAL PAINT OR INK REMOVERS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CORRECTING FLUIDS ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; DYES ; FILLING PASTES ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; INKS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; PERFORMING OPERATIONS ; POLISHES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS AS ADHESIVES ; USE OF MATERIALS THEREFOR ; WOODSTAINS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241107&DB=EPODOC&CC=KR&NR=20240159882A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20241107&DB=EPODOC&CC=KR&NR=20240159882A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OOSATO TAKUTO</creatorcontrib><creatorcontrib>ENDO HIROTAKA</creatorcontrib><creatorcontrib>NAKATSUJI AKIRA</creatorcontrib><title>에폭시 수지 조성물, 금속 표면 처리용 조성물, 금속 적층판의 제조 방법, 및 금속판의 접착 방법</title><description>본 개시는 (A) 에폭시 수지, (B) 아미노실란계 화합물, (C) 카르보디이미드 화합물, 이소시아네이트계 화합물, 폴리에테르아민계 화합물, 인산 변성 에폭시 수지, 멜라민 수지, 및 페놀 수지로 이루어지는 군에서 선택되는 1 종 또는 2 종 이상인 가교제, 및 (D) 물을 함유하는, 에폭시 수지 조성물, 그 에폭시 수지 조성물을 포함하는 금속 표면 처리용 조성물, 금속판의 제조 방법, 및 금속판의 접착 방법을 제공한다.
The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide compound, an isocyanate-based compound, a polyetheramine-based compound, a phosphoric acid-modified epoxy resin, a melamine resin and a phenolic resin, and (D) water; a composition for metal surface processing, which contains said epoxy resin composition; a method for producing a metal sheet; and a method for bonding a metal sheet.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CORRECTING FLUIDS</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>DYES</subject><subject>FILLING PASTES</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>INKS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGh4M33C2_61b7rnKLzpmPFmeYPCm4Ub3rRsfL1mj47Cqx0db9p6Fd5OnPN65RaFN5tmvF625s2slViUvFnQ-GbH1rc9E97MnQHkzAGqUHi9YeXrTVN1gHQ_VBlcfuKbDSuh8jwMrGmJOcWpvFCam0HZzTXE2UM3tSA_PrW4IDE5NS-1JN47yMjAyMTA0NTSwsLI0Zg4VQBi-Gx_</recordid><startdate>20241107</startdate><enddate>20241107</enddate><creator>OOSATO TAKUTO</creator><creator>ENDO HIROTAKA</creator><creator>NAKATSUJI AKIRA</creator><scope>EVB</scope></search><sort><creationdate>20241107</creationdate><title>에폭시 수지 조성물, 금속 표면 처리용 조성물, 금속 적층판의 제조 방법, 및 금속판의 접착 방법</title><author>OOSATO TAKUTO ; ENDO HIROTAKA ; NAKATSUJI AKIRA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240159882A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2024</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CORRECTING FLUIDS</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>DYES</topic><topic>FILLING PASTES</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>INKS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><toplevel>online_resources</toplevel><creatorcontrib>OOSATO TAKUTO</creatorcontrib><creatorcontrib>ENDO HIROTAKA</creatorcontrib><creatorcontrib>NAKATSUJI AKIRA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>OOSATO TAKUTO</au><au>ENDO HIROTAKA</au><au>NAKATSUJI AKIRA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>에폭시 수지 조성물, 금속 표면 처리용 조성물, 금속 적층판의 제조 방법, 및 금속판의 접착 방법</title><date>2024-11-07</date><risdate>2024</risdate><abstract>본 개시는 (A) 에폭시 수지, (B) 아미노실란계 화합물, (C) 카르보디이미드 화합물, 이소시아네이트계 화합물, 폴리에테르아민계 화합물, 인산 변성 에폭시 수지, 멜라민 수지, 및 페놀 수지로 이루어지는 군에서 선택되는 1 종 또는 2 종 이상인 가교제, 및 (D) 물을 함유하는, 에폭시 수지 조성물, 그 에폭시 수지 조성물을 포함하는 금속 표면 처리용 조성물, 금속판의 제조 방법, 및 금속판의 접착 방법을 제공한다.
The present disclosure provides: an epoxy resin composition that contains (A) an epoxy resin, (B) an aminosilane-based compound, (C) a crosslinking agent that is one or more types selected from the group consisting of a carbodiimide compound, an isocyanate-based compound, a polyetheramine-based compound, a phosphoric acid-modified epoxy resin, a melamine resin and a phenolic resin, and (D) water; a composition for metal surface processing, which contains said epoxy resin composition; a method for producing a metal sheet; and a method for bonding a metal sheet.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DIFFUSION TREATMENT OF METALLIC MATERIAL DYES FILLING PASTES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | 에폭시 수지 조성물, 금속 표면 처리용 조성물, 금속 적층판의 제조 방법, 및 금속판의 접착 방법 |
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