배선 회로 기판 및 그의 제조 방법

재배선 기판은, 상면 및 하면을 포함함과 함께 비아 홀을 포함하는 금속 지지체를 포함한다. 금속 지지체의 외표면은 피복층에 의해 덮인다. 피복층을 개재하여 금속 지지체의 상면, 하면 및 비아 홀의 내주면 상에 도체층이 형성된다. 비아 홀의 개구부를 통과하는 금속 지지체의 단면에서, 비아 홀의 내주면을 나타내는 윤곽선은 만곡되어 있다. 비아 홀은, 내주면의 윤곽선이 미리 정해진 조건을 따르도록, 형성된다. Provided is a rewiring board comprising a metal support which incudes a...

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Hauptverfasser:	ISHII JUN, HODONO MASAYUKI, ASO TOMOKI, KUWAYAMA HIRONORI, KAMAKURA MASAKI, OYABU YASUNARI, JURO NAOSHI
Format:	Patent
Sprache:	kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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creator	ISHII JUN HODONO MASAYUKI ASO TOMOKI KUWAYAMA HIRONORI KAMAKURA MASAKI OYABU YASUNARI JURO NAOSHI
description	재배선 기판은, 상면 및 하면을 포함함과 함께 비아 홀을 포함하는 금속 지지체를 포함한다. 금속 지지체의 외표면은 피복층에 의해 덮인다. 피복층을 개재하여 금속 지지체의 상면, 하면 및 비아 홀의 내주면 상에 도체층이 형성된다. 비아 홀의 개구부를 통과하는 금속 지지체의 단면에서, 비아 홀의 내주면을 나타내는 윤곽선은 만곡되어 있다. 비아 홀은, 내주면의 윤곽선이 미리 정해진 조건을 따르도록, 형성된다. Provided is a rewiring board comprising a metal support which incudes a top surface and a bottom surface and includes a via hole. The outer surface of the metal support is covered by a coating layer. A conductor layer is formed on the top surface and the bottom surface of the metal support and an inner peripheral surface of the via hole through the coating layer. In a cross section of the metal support passing through the opening of the via hole, a contour line representing the inner peripheral surface of the via holes is curved. The via hole is formed such that the contour line of the inner peripheral surface conforms to a predetermined condition.
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Provided is a rewiring board comprising a metal support which incudes a top surface and a bottom surface and includes a via hole. The outer surface of the metal support is covered by a coating layer. A conductor layer is formed on the top surface and the bottom surface of the metal support and an inner peripheral surface of the via hole through the coating layer. In a cross section of the metal support passing through the opening of the via hole, a contour line representing the inner peripheral surface of the via holes is curved. 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Provided is a rewiring board comprising a metal support which incudes a top surface and a bottom surface and includes a via hole. The outer surface of the metal support is covered by a coating layer. A conductor layer is formed on the top surface and the bottom surface of the metal support and an inner peripheral surface of the via hole through the coating layer. In a cross section of the metal support passing through the opening of the via hole, a contour line representing the inner peripheral surface of the via holes is curved. 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Provided is a rewiring board comprising a metal support which incudes a top surface and a bottom surface and includes a via hole. The outer surface of the metal support is covered by a coating layer. A conductor layer is formed on the top surface and the bottom surface of the metal support and an inner peripheral surface of the via hole through the coating layer. In a cross section of the metal support passing through the opening of the via hole, a contour line representing the inner peripheral surface of the via holes is curved. The via hole is formed such that the contour line of the inner peripheral surface conforms to a predetermined condition.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
title	배선 회로 기판 및 그의 제조 방법
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