Substrate treating apparatus and semiconductor manufacturing equipment including the same
레이저를 이용하여 반도체 기판을 처리하는 기판 처리 장치 및 이를 포함하는 반도체 제조 설비를 제공한다. 상기 기판 처리 장치는, 기판이 처리되는 공간을 제공하는 챔버; 챔버 내에 배치되며, 기판을 지지하는 지지 모듈; 및 챔버 내에 배치되며, 기판 상으로 레이저 신호를 송출하여 기판을 열처리하는 레이저 신호 생성 모듈을 포함하며, 레이저 신호 생성 모듈은 포토레지스트 레이어를 포함하는 기판을 열처리한다. Provided is a substrate processing apparatus that processes a semicondu...
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| creator | KIM JU WON CHOI BYOUNG DOO PARK JONG HYUK JUNG GI HUN PARK DONG WOON KIM SEONG SUE CHO A RAH |
| description | 레이저를 이용하여 반도체 기판을 처리하는 기판 처리 장치 및 이를 포함하는 반도체 제조 설비를 제공한다. 상기 기판 처리 장치는, 기판이 처리되는 공간을 제공하는 챔버; 챔버 내에 배치되며, 기판을 지지하는 지지 모듈; 및 챔버 내에 배치되며, 기판 상으로 레이저 신호를 송출하여 기판을 열처리하는 레이저 신호 생성 모듈을 포함하며, 레이저 신호 생성 모듈은 포토레지스트 레이어를 포함하는 기판을 열처리한다.
Provided is a substrate processing apparatus that processes a semiconductor substrate using a laser and a semiconductor manufacturing equipment including the same. The substrate processing apparatus comprises a chamber for providing a space where a substrate is processed; a support module disposed within the chamber and for supporting the substrate; and a laser signal generation module disposed in the chamber and for transmitting a laser signal onto the substrate to heat-treat the substrate, wherein the laser signal generation module heat-treats the substrate including a photoresist layer. |
| format | Patent |
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Provided is a substrate processing apparatus that processes a semiconductor substrate using a laser and a semiconductor manufacturing equipment including the same. The substrate processing apparatus comprises a chamber for providing a space where a substrate is processed; a support module disposed within the chamber and for supporting the substrate; and a laser signal generation module disposed in the chamber and for transmitting a laser signal onto the substrate to heat-treat the substrate, wherein the laser signal generation module heat-treats the substrate including a photoresist layer.</description><language>eng ; kor</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MACHINE TOOLS ; MATERIALS THEREFOR ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240709&DB=EPODOC&CC=KR&NR=20240107923A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240709&DB=EPODOC&CC=KR&NR=20240107923A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM JU WON</creatorcontrib><creatorcontrib>CHOI BYOUNG DOO</creatorcontrib><creatorcontrib>PARK JONG HYUK</creatorcontrib><creatorcontrib>JUNG GI HUN</creatorcontrib><creatorcontrib>PARK DONG WOON</creatorcontrib><creatorcontrib>KIM SEONG SUE</creatorcontrib><creatorcontrib>CHO A RAH</creatorcontrib><title>Substrate treating apparatus and semiconductor manufacturing equipment including the same</title><description>레이저를 이용하여 반도체 기판을 처리하는 기판 처리 장치 및 이를 포함하는 반도체 제조 설비를 제공한다. 상기 기판 처리 장치는, 기판이 처리되는 공간을 제공하는 챔버; 챔버 내에 배치되며, 기판을 지지하는 지지 모듈; 및 챔버 내에 배치되며, 기판 상으로 레이저 신호를 송출하여 기판을 열처리하는 레이저 신호 생성 모듈을 포함하며, 레이저 신호 생성 모듈은 포토레지스트 레이어를 포함하는 기판을 열처리한다.
Provided is a substrate processing apparatus that processes a semiconductor substrate using a laser and a semiconductor manufacturing equipment including the same. The substrate processing apparatus comprises a chamber for providing a space where a substrate is processed; a support module disposed within the chamber and for supporting the substrate; and a laser signal generation module disposed in the chamber and for transmitting a laser signal onto the substrate to heat-treat the substrate, wherein the laser signal generation module heat-treats the substrate including a photoresist layer.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACHINE TOOLS</subject><subject>MATERIALS THEREFOR</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQgOEsDqK-w4GzEFtBOooogpu6OJUzvWqgucTk7v214AM4_fDxT839qo8iGYVAMqF4fgKmhF_RAsgdFAreRe7UScwQkLVHJ5rHk97qUyAW8OwG7UaTF0HBQHMz6XEotPh1ZpbHw21_WlGKLZWEjpikPV8qW23s2m6bqt7V_10fgzs8xg</recordid><startdate>20240709</startdate><enddate>20240709</enddate><creator>KIM JU WON</creator><creator>CHOI BYOUNG DOO</creator><creator>PARK JONG HYUK</creator><creator>JUNG GI HUN</creator><creator>PARK DONG WOON</creator><creator>KIM SEONG SUE</creator><creator>CHO A RAH</creator><scope>EVB</scope></search><sort><creationdate>20240709</creationdate><title>Substrate treating apparatus and semiconductor manufacturing equipment including the same</title><author>KIM JU WON ; CHOI BYOUNG DOO ; PARK JONG HYUK ; JUNG GI HUN ; PARK DONG WOON ; KIM SEONG SUE ; CHO A RAH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240107923A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2024</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACHINE TOOLS</topic><topic>MATERIALS THEREFOR</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM JU WON</creatorcontrib><creatorcontrib>CHOI BYOUNG DOO</creatorcontrib><creatorcontrib>PARK JONG HYUK</creatorcontrib><creatorcontrib>JUNG GI HUN</creatorcontrib><creatorcontrib>PARK DONG WOON</creatorcontrib><creatorcontrib>KIM SEONG SUE</creatorcontrib><creatorcontrib>CHO A RAH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM JU WON</au><au>CHOI BYOUNG DOO</au><au>PARK JONG HYUK</au><au>JUNG GI HUN</au><au>PARK DONG WOON</au><au>KIM SEONG SUE</au><au>CHO A RAH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate treating apparatus and semiconductor manufacturing equipment including the same</title><date>2024-07-09</date><risdate>2024</risdate><abstract>레이저를 이용하여 반도체 기판을 처리하는 기판 처리 장치 및 이를 포함하는 반도체 제조 설비를 제공한다. 상기 기판 처리 장치는, 기판이 처리되는 공간을 제공하는 챔버; 챔버 내에 배치되며, 기판을 지지하는 지지 모듈; 및 챔버 내에 배치되며, 기판 상으로 레이저 신호를 송출하여 기판을 열처리하는 레이저 신호 생성 모듈을 포함하며, 레이저 신호 생성 모듈은 포토레지스트 레이어를 포함하는 기판을 열처리한다.
Provided is a substrate processing apparatus that processes a semiconductor substrate using a laser and a semiconductor manufacturing equipment including the same. The substrate processing apparatus comprises a chamber for providing a space where a substrate is processed; a support module disposed within the chamber and for supporting the substrate; and a laser signal generation module disposed in the chamber and for transmitting a laser signal onto the substrate to heat-treat the substrate, wherein the laser signal generation module heat-treats the substrate including a photoresist layer.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACHINE TOOLS MATERIALS THEREFOR METAL-WORKING NOT OTHERWISE PROVIDED FOR ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Substrate treating apparatus and semiconductor manufacturing equipment including the same |
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