디바이스 제조 툴들의 분석을 위한 열적 이미징 (THERMAL IMAGING)
카메라 센서들과 같은 멀티-픽셀 센서들은 프로세스 챔버 또는 다른 제조 툴의 내부의 2 차원 이미지 및/또는 3 차원 이미지를 캡처하도록 구성될 수도 있다. 센서들은 챔버 내에서 기판의 프로세싱 전, 프로세싱 동안 및/또는 프로세싱 후에 이러한 프로세스 챔버의 내부로부터 픽셀화된 전자기 복사선 강도 정보를 캡처하도록 구성될 수도 있다. 이러한 센서들은 또한 제어 애플리케이션, 예측 애플리케이션 및/또는 진단 애플리케이션을 위해 활용될 수도 있다. Multi-pixel sensors such as camera sensors may b...
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| creator | SAWLANI KAPIL SAKIYAMA YUKINORI HASKELL BENJAMIN ALLEN FRANZEN PAUL LEESER KARL FREDERICK DANEK MICHAL REDDY KAPU SIRISH |
| description | 카메라 센서들과 같은 멀티-픽셀 센서들은 프로세스 챔버 또는 다른 제조 툴의 내부의 2 차원 이미지 및/또는 3 차원 이미지를 캡처하도록 구성될 수도 있다. 센서들은 챔버 내에서 기판의 프로세싱 전, 프로세싱 동안 및/또는 프로세싱 후에 이러한 프로세스 챔버의 내부로부터 픽셀화된 전자기 복사선 강도 정보를 캡처하도록 구성될 수도 있다. 이러한 센서들은 또한 제어 애플리케이션, 예측 애플리케이션 및/또는 진단 애플리케이션을 위해 활용될 수도 있다.
Multi-pixel sensors such as camera sensors may be configured to capture two-dimensional and/or three-dimensional images of the interior of a process chamber or other fabrication tool. The sensors may be configured to capture pixelated electromagnetic radiation intensity information from within the interior of such process chamber before, during, and/or after processing of a substrate in the chamber. Such sensors may also be utilized for control, predictive, and/or diagnostic applications. |
| format | Patent |
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Multi-pixel sensors such as camera sensors may be configured to capture two-dimensional and/or three-dimensional images of the interior of a process chamber or other fabrication tool. The sensors may be configured to capture pixelated electromagnetic radiation intensity information from within the interior of such process chamber before, during, and/or after processing of a substrate in the chamber. Such sensors may also be utilized for control, predictive, and/or diagnostic applications.</description><language>kor</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; COLORIMETRY ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT ; MEASURING ; METALLURGY ; PHYSICS ; RADIATION PYROMETRY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TESTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240624&DB=EPODOC&CC=KR&NR=20240093970A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240624&DB=EPODOC&CC=KR&NR=20240093970A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAWLANI KAPIL</creatorcontrib><creatorcontrib>SAKIYAMA YUKINORI</creatorcontrib><creatorcontrib>HASKELL BENJAMIN ALLEN</creatorcontrib><creatorcontrib>FRANZEN PAUL</creatorcontrib><creatorcontrib>LEESER KARL FREDERICK</creatorcontrib><creatorcontrib>DANEK MICHAL</creatorcontrib><creatorcontrib>REDDY KAPU SIRISH</creatorcontrib><title>디바이스 제조 툴들의 분석을 위한 열적 이미징 (THERMAL IMAGING)</title><description>카메라 센서들과 같은 멀티-픽셀 센서들은 프로세스 챔버 또는 다른 제조 툴의 내부의 2 차원 이미지 및/또는 3 차원 이미지를 캡처하도록 구성될 수도 있다. 센서들은 챔버 내에서 기판의 프로세싱 전, 프로세싱 동안 및/또는 프로세싱 후에 이러한 프로세스 챔버의 내부로부터 픽셀화된 전자기 복사선 강도 정보를 캡처하도록 구성될 수도 있다. 이러한 센서들은 또한 제어 애플리케이션, 예측 애플리케이션 및/또는 진단 애플리케이션을 위해 활용될 수도 있다.
Multi-pixel sensors such as camera sensors may be configured to capture two-dimensional and/or three-dimensional images of the interior of a process chamber or other fabrication tool. The sensors may be configured to capture pixelated electromagnetic radiation intensity information from within the interior of such process chamber before, during, and/or after processing of a substrate in the chamber. Such sensors may also be utilized for control, predictive, and/or diagnostic applications.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>COLORIMETRY</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT</subject><subject>MEASURING</subject><subject>METALLURGY</subject><subject>PHYSICS</subject><subject>RADIATION PYROMETRY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAh8PWXK6w1T3szd8qZricKbBXPeLNyg8LZjy-vJS97MnaHwelvLm5a5b-a2KLyZ0_J26hyFN9O3vFnQqABU_3r9jjfLpypohHi4Bvk6-ih4-jq6e_q5a_IwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUknjvICMDIxMDA0tjS3MDR2PiVAEAzeRIRA</recordid><startdate>20240624</startdate><enddate>20240624</enddate><creator>SAWLANI KAPIL</creator><creator>SAKIYAMA YUKINORI</creator><creator>HASKELL BENJAMIN ALLEN</creator><creator>FRANZEN PAUL</creator><creator>LEESER KARL FREDERICK</creator><creator>DANEK MICHAL</creator><creator>REDDY KAPU SIRISH</creator><scope>EVB</scope></search><sort><creationdate>20240624</creationdate><title>디바이스 제조 툴들의 분석을 위한 열적 이미징 (THERMAL IMAGING)</title><author>SAWLANI KAPIL ; SAKIYAMA YUKINORI ; HASKELL BENJAMIN ALLEN ; FRANZEN PAUL ; LEESER KARL FREDERICK ; DANEK MICHAL ; REDDY KAPU SIRISH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240093970A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2024</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>COLORIMETRY</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT</topic><topic>MEASURING</topic><topic>METALLURGY</topic><topic>PHYSICS</topic><topic>RADIATION PYROMETRY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SAWLANI KAPIL</creatorcontrib><creatorcontrib>SAKIYAMA YUKINORI</creatorcontrib><creatorcontrib>HASKELL BENJAMIN ALLEN</creatorcontrib><creatorcontrib>FRANZEN PAUL</creatorcontrib><creatorcontrib>LEESER KARL FREDERICK</creatorcontrib><creatorcontrib>DANEK MICHAL</creatorcontrib><creatorcontrib>REDDY KAPU SIRISH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAWLANI KAPIL</au><au>SAKIYAMA YUKINORI</au><au>HASKELL BENJAMIN ALLEN</au><au>FRANZEN PAUL</au><au>LEESER KARL FREDERICK</au><au>DANEK MICHAL</au><au>REDDY KAPU SIRISH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>디바이스 제조 툴들의 분석을 위한 열적 이미징 (THERMAL IMAGING)</title><date>2024-06-24</date><risdate>2024</risdate><abstract>카메라 센서들과 같은 멀티-픽셀 센서들은 프로세스 챔버 또는 다른 제조 툴의 내부의 2 차원 이미지 및/또는 3 차원 이미지를 캡처하도록 구성될 수도 있다. 센서들은 챔버 내에서 기판의 프로세싱 전, 프로세싱 동안 및/또는 프로세싱 후에 이러한 프로세스 챔버의 내부로부터 픽셀화된 전자기 복사선 강도 정보를 캡처하도록 구성될 수도 있다. 이러한 센서들은 또한 제어 애플리케이션, 예측 애플리케이션 및/또는 진단 애플리케이션을 위해 활용될 수도 있다.
Multi-pixel sensors such as camera sensors may be configured to capture two-dimensional and/or three-dimensional images of the interior of a process chamber or other fabrication tool. The sensors may be configured to capture pixelated electromagnetic radiation intensity information from within the interior of such process chamber before, during, and/or after processing of a substrate in the chamber. Such sensors may also be utilized for control, predictive, and/or diagnostic applications.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL COLORIMETRY DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT MEASURING METALLURGY PHYSICS RADIATION PYROMETRY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TESTING |
| title | 디바이스 제조 툴들의 분석을 위한 열적 이미징 (THERMAL IMAGING) |
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