할로겐 프리 난연 경화성 수지 조성물, 프리프레그, 금속장 적층판, 및 프린트 배선판
유전 특성, 접착성, 난연성이 뛰어난 할로겐 프리 난연 경화성 수지 조성물, 경화성 수지 조성물과 기재로 이루어지는 프리프레그, 금속장 적층판, 및 프린트 배선판을 제공하는 것에 있다. (A) 탄소-탄소 불포화 이중 결합을 분자 내에 갖는 라디칼 중합성 화합물과, (B) 인계 난연제와, (C) 알콕시이미노(NOR)형 힌더드아민 화합물과, (D) 라디칼 중합 개시제를 포함하는 수지 조성물로서, 인 함유율이 (A) 성분과 (B) 성분의 합계에 대하여 1.0∼5.0질량%이고, (C) 성분의 함유량이 (A) 성분과 (B) 성분의 합계 10...
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| creator | WASANO TSUGUTOSHI |
| description | 유전 특성, 접착성, 난연성이 뛰어난 할로겐 프리 난연 경화성 수지 조성물, 경화성 수지 조성물과 기재로 이루어지는 프리프레그, 금속장 적층판, 및 프린트 배선판을 제공하는 것에 있다. (A) 탄소-탄소 불포화 이중 결합을 분자 내에 갖는 라디칼 중합성 화합물과, (B) 인계 난연제와, (C) 알콕시이미노(NOR)형 힌더드아민 화합물과, (D) 라디칼 중합 개시제를 포함하는 수지 조성물로서, 인 함유율이 (A) 성분과 (B) 성분의 합계에 대하여 1.0∼5.0질량%이고, (C) 성분의 함유량이 (A) 성분과 (B) 성분의 합계 100질량부에 대하여 0.2∼5.0질량부인 것을 특징으로 하는 할로겐 프리 난연 경화성 수지 조성물이다.
The purpose of the present invention is to provide: a halogen-free flame-retardant curable resin composition having excellent dielectric properties, adhesion properties and flame retardancy; a prepreg comprising a curable resin composition and a base material; a metal-clad laminated board; and a printed wiring board. The halogen-free flame-retardant curable resin composition comprises (A) a radical-polymerizable compound having a carbon-carbon unsaturated double bond in the molecule thereof, (B) a phosphorus-based flame-retardant agent, (C) an alkoxyimino (NOR)-type hindered amine compound and (D) a radical polymerization initiator, the resin composition being characterized in that the content of phosphorus is 1.0 to 5.0% by mass relative to the total amount of the components (A) and (B) and the content of the component (C) is 0.2 to 5.0 parts by mass relative to the total amount, i.e., 100 parts by mass, of the components (A) and (B). |
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The purpose of the present invention is to provide: a halogen-free flame-retardant curable resin composition having excellent dielectric properties, adhesion properties and flame retardancy; a prepreg comprising a curable resin composition and a base material; a metal-clad laminated board; and a printed wiring board. The halogen-free flame-retardant curable resin composition comprises (A) a radical-polymerizable compound having a carbon-carbon unsaturated double bond in the molecule thereof, (B) a phosphorus-based flame-retardant agent, (C) an alkoxyimino (NOR)-type hindered amine compound and (D) a radical polymerization initiator, the resin composition being characterized in that the content of phosphorus is 1.0 to 5.0% by mass relative to the total amount of the components (A) and (B) and the content of the component (C) is 0.2 to 5.0 parts by mass relative to the total amount, i.e., 100 parts by mass, of the components (A) and (B).</description><language>kor</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240529&DB=EPODOC&CC=KR&NR=20240075803A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240529&DB=EPODOC&CC=KR&NR=20240075803A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WASANO TSUGUTOSHI</creatorcontrib><title>할로겐 프리 난연 경화성 수지 조성물, 프리프레그, 금속장 적층판, 및 프린트 배선판</title><description>유전 특성, 접착성, 난연성이 뛰어난 할로겐 프리 난연 경화성 수지 조성물, 경화성 수지 조성물과 기재로 이루어지는 프리프레그, 금속장 적층판, 및 프린트 배선판을 제공하는 것에 있다. (A) 탄소-탄소 불포화 이중 결합을 분자 내에 갖는 라디칼 중합성 화합물과, (B) 인계 난연제와, (C) 알콕시이미노(NOR)형 힌더드아민 화합물과, (D) 라디칼 중합 개시제를 포함하는 수지 조성물로서, 인 함유율이 (A) 성분과 (B) 성분의 합계에 대하여 1.0∼5.0질량%이고, (C) 성분의 함유량이 (A) 성분과 (B) 성분의 합계 100질량부에 대하여 0.2∼5.0질량부인 것을 특징으로 하는 할로겐 프리 난연 경화성 수지 조성물이다.
The purpose of the present invention is to provide: a halogen-free flame-retardant curable resin composition having excellent dielectric properties, adhesion properties and flame retardancy; a prepreg comprising a curable resin composition and a base material; a metal-clad laminated board; and a printed wiring board. The halogen-free flame-retardant curable resin composition comprises (A) a radical-polymerizable compound having a carbon-carbon unsaturated double bond in the molecule thereof, (B) a phosphorus-based flame-retardant agent, (C) an alkoxyimino (NOR)-type hindered amine compound and (D) a radical polymerization initiator, the resin composition being characterized in that the content of phosphorus is 1.0 to 5.0% by mass relative to the total amount of the components (A) and (B) and the content of the component (C) is 0.2 to 5.0 parts by mass relative to the total amount, i.e., 100 parts by mass, of the components (A) and (B).</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCh8O3XB64VzXm2aoPB2SsvrZWsUXjfNeTN9g8KrTXvfzpzypmWjwpuOGW-WNyi8WbgByHu9Zo8OVCWIXNDxavsOHYVXOzretPW-mbdU4c2Cxjc7tr7tmaCj8HpDP0TlhrddO4A8oPYFQAkeBta0xJziVF4ozc2g7OYa4uyhm1qQH59aXJCYnJqXWhLvHWRkYGRiYGBuamFg7GhMnCoAdm5i6w</recordid><startdate>20240529</startdate><enddate>20240529</enddate><creator>WASANO TSUGUTOSHI</creator><scope>EVB</scope></search><sort><creationdate>20240529</creationdate><title>할로겐 프리 난연 경화성 수지 조성물, 프리프레그, 금속장 적층판, 및 프린트 배선판</title><author>WASANO TSUGUTOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240075803A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>WASANO TSUGUTOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WASANO TSUGUTOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>할로겐 프리 난연 경화성 수지 조성물, 프리프레그, 금속장 적층판, 및 프린트 배선판</title><date>2024-05-29</date><risdate>2024</risdate><abstract>유전 특성, 접착성, 난연성이 뛰어난 할로겐 프리 난연 경화성 수지 조성물, 경화성 수지 조성물과 기재로 이루어지는 프리프레그, 금속장 적층판, 및 프린트 배선판을 제공하는 것에 있다. (A) 탄소-탄소 불포화 이중 결합을 분자 내에 갖는 라디칼 중합성 화합물과, (B) 인계 난연제와, (C) 알콕시이미노(NOR)형 힌더드아민 화합물과, (D) 라디칼 중합 개시제를 포함하는 수지 조성물로서, 인 함유율이 (A) 성분과 (B) 성분의 합계에 대하여 1.0∼5.0질량%이고, (C) 성분의 함유량이 (A) 성분과 (B) 성분의 합계 100질량부에 대하여 0.2∼5.0질량부인 것을 특징으로 하는 할로겐 프리 난연 경화성 수지 조성물이다.
The purpose of the present invention is to provide: a halogen-free flame-retardant curable resin composition having excellent dielectric properties, adhesion properties and flame retardancy; a prepreg comprising a curable resin composition and a base material; a metal-clad laminated board; and a printed wiring board. The halogen-free flame-retardant curable resin composition comprises (A) a radical-polymerizable compound having a carbon-carbon unsaturated double bond in the molecule thereof, (B) a phosphorus-based flame-retardant agent, (C) an alkoxyimino (NOR)-type hindered amine compound and (D) a radical polymerization initiator, the resin composition being characterized in that the content of phosphorus is 1.0 to 5.0% by mass relative to the total amount of the components (A) and (B) and the content of the component (C) is 0.2 to 5.0 parts by mass relative to the total amount, i.e., 100 parts by mass, of the components (A) and (B).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | 할로겐 프리 난연 경화성 수지 조성물, 프리프레그, 금속장 적층판, 및 프린트 배선판 |
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