RESIN COMPOSITION AND PRINTED CIRCUIT BOARD
본 출원의 일 실시상태에 따른 수지 조성물은, 에폭시계 수지; 시아네이트 에스테르계 수지 및 페놀계 수지를 포함하는 경화제; 실리카 입자를 포함하는 무기 입자; 및 경화촉진제를 포함하고, 상기 시아네이트 에스테르계 수지 : 페놀계 수지의 중량비는 95 : 5 내지 40 : 60 이고, 상기 경화촉진제는 이미다졸계 화합물 및 금속계 화합물을 동시에 포함한다. The resin composition according to an exemplary embodiment of the present application comprises: an...
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| creator | YOON YOUNGSIK CHOI BYUNG JU PARK JUN WUK KIM TAE SOON |
| description | 본 출원의 일 실시상태에 따른 수지 조성물은, 에폭시계 수지; 시아네이트 에스테르계 수지 및 페놀계 수지를 포함하는 경화제; 실리카 입자를 포함하는 무기 입자; 및 경화촉진제를 포함하고, 상기 시아네이트 에스테르계 수지 : 페놀계 수지의 중량비는 95 : 5 내지 40 : 60 이고, 상기 경화촉진제는 이미다졸계 화합물 및 금속계 화합물을 동시에 포함한다.
The resin composition according to an exemplary embodiment of the present application comprises: an epoxy-based resin; a curing agent comprising a cyanate ester-based resin and a phenolic resin; inorganic particles comprising silica particles; and a curing accelerator, the weight ratio of the cyanate ester-based resin : the phenolic resin is 95 : 5 to 40 : 60, and the curing accelerator comprises both an imidazole-based compound and a metal-based compound. |
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The resin composition according to an exemplary embodiment of the present application comprises: an epoxy-based resin; a curing agent comprising a cyanate ester-based resin and a phenolic resin; inorganic particles comprising silica particles; and a curing accelerator, the weight ratio of the cyanate ester-based resin : the phenolic resin is 95 : 5 to 40 : 60, and the curing accelerator comprises both an imidazole-based compound and a metal-based compound.</description><language>eng ; kor</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240514&DB=EPODOC&CC=KR&NR=20240066073A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240514&DB=EPODOC&CC=KR&NR=20240066073A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YOON YOUNGSIK</creatorcontrib><creatorcontrib>CHOI BYUNG JU</creatorcontrib><creatorcontrib>PARK JUN WUK</creatorcontrib><creatorcontrib>KIM TAE SOON</creatorcontrib><title>RESIN COMPOSITION AND PRINTED CIRCUIT BOARD</title><description>본 출원의 일 실시상태에 따른 수지 조성물은, 에폭시계 수지; 시아네이트 에스테르계 수지 및 페놀계 수지를 포함하는 경화제; 실리카 입자를 포함하는 무기 입자; 및 경화촉진제를 포함하고, 상기 시아네이트 에스테르계 수지 : 페놀계 수지의 중량비는 95 : 5 내지 40 : 60 이고, 상기 경화촉진제는 이미다졸계 화합물 및 금속계 화합물을 동시에 포함한다.
The resin composition according to an exemplary embodiment of the present application comprises: an epoxy-based resin; a curing agent comprising a cyanate ester-based resin and a phenolic resin; inorganic particles comprising silica particles; and a curing accelerator, the weight ratio of the cyanate ester-based resin : the phenolic resin is 95 : 5 to 40 : 60, and the curing accelerator comprises both an imidazole-based compound and a metal-based compound.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAOcg329FNw9vcN8A_2DPH091Nw9HNRCAjy9AtxdVFw9gxyDvUMUXDydwxy4WFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8d5BRgZGJgYGZmYG5saOxsSpAgAKLyXD</recordid><startdate>20240514</startdate><enddate>20240514</enddate><creator>YOON YOUNGSIK</creator><creator>CHOI BYUNG JU</creator><creator>PARK JUN WUK</creator><creator>KIM TAE SOON</creator><scope>EVB</scope></search><sort><creationdate>20240514</creationdate><title>RESIN COMPOSITION AND PRINTED CIRCUIT BOARD</title><author>YOON YOUNGSIK ; CHOI BYUNG JU ; PARK JUN WUK ; KIM TAE SOON</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240066073A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2024</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>YOON YOUNGSIK</creatorcontrib><creatorcontrib>CHOI BYUNG JU</creatorcontrib><creatorcontrib>PARK JUN WUK</creatorcontrib><creatorcontrib>KIM TAE SOON</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YOON YOUNGSIK</au><au>CHOI BYUNG JU</au><au>PARK JUN WUK</au><au>KIM TAE SOON</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN COMPOSITION AND PRINTED CIRCUIT BOARD</title><date>2024-05-14</date><risdate>2024</risdate><abstract>본 출원의 일 실시상태에 따른 수지 조성물은, 에폭시계 수지; 시아네이트 에스테르계 수지 및 페놀계 수지를 포함하는 경화제; 실리카 입자를 포함하는 무기 입자; 및 경화촉진제를 포함하고, 상기 시아네이트 에스테르계 수지 : 페놀계 수지의 중량비는 95 : 5 내지 40 : 60 이고, 상기 경화촉진제는 이미다졸계 화합물 및 금속계 화합물을 동시에 포함한다.
The resin composition according to an exemplary embodiment of the present application comprises: an epoxy-based resin; a curing agent comprising a cyanate ester-based resin and a phenolic resin; inorganic particles comprising silica particles; and a curing accelerator, the weight ratio of the cyanate ester-based resin : the phenolic resin is 95 : 5 to 40 : 60, and the curing accelerator comprises both an imidazole-based compound and a metal-based compound.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | RESIN COMPOSITION AND PRINTED CIRCUIT BOARD |
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