5G FCCL Low dielectric high heat dissipation film composition for 5G FCCL and manufacturing method thereof

저유전특성 및 향상된 방열특성을 갖는 우수한 성능의 5G FCCL용 저유전 고방열 필름을 얻을 수 있는 5G FCCL용 저유전 고방열 필름 조성물 및 그의 제조방법이 제안된다. 본 5G FCCL용 저유전 고방열 필름 조성물은 고분자 수지; 및 단단한 응집 질화붕소(Hard agglomerated boron nitride, Hard a-BN) 및 단단한 응집 질화붕소 표면에 부착된 질화붕소나노튜브(Boron Nitride Nanotubes, BNNT)를 포함하는 Hard a-BN-BNNT 하이브리드 필러;를 포함한다....

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Bibliographische Detailangaben

Hauptverfasser:	YOO MYONG JAE, JEON YEONG MU, YANG HYUN SEUNG, LEE CHURL SEUNG, LEE DONG MIN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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