ELECTROSTATIC CHUCK DEVICE

본 발명은, 세라믹스층을 형성할 때에 발생하는 열에 의한 기판과 슬리브의 열팽창의 차이에 기인하여, 세라믹스층에 균열이 생기는 것을 억제한 정전 척 장치를 제공하는 것을 목적으로 한다. 본 발명의 정전 척 장치(1)는, 기판(10)과, 기판(10) 상에 적층된 내부 전극(20)을 적어도 포함하는 적층체(2)와, 적층체(2)의 두께 방향의 상면에 적층된 세라믹스층(50)을 구비하고, 기판(10)은, 두께 방향으로 관통하여 마련된 관통 구멍(60)을 가지고, 관통 구멍(60)에 절연성 재료로 이루어지는 슬리브(70)가 삽입되며, 슬리브...

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Hauptverfasser: TOCHIHIRA JUN, HAGIHARA TOMOYA
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creator TOCHIHIRA JUN
HAGIHARA TOMOYA
description 본 발명은, 세라믹스층을 형성할 때에 발생하는 열에 의한 기판과 슬리브의 열팽창의 차이에 기인하여, 세라믹스층에 균열이 생기는 것을 억제한 정전 척 장치를 제공하는 것을 목적으로 한다. 본 발명의 정전 척 장치(1)는, 기판(10)과, 기판(10) 상에 적층된 내부 전극(20)을 적어도 포함하는 적층체(2)와, 적층체(2)의 두께 방향의 상면에 적층된 세라믹스층(50)을 구비하고, 기판(10)은, 두께 방향으로 관통하여 마련된 관통 구멍(60)을 가지고, 관통 구멍(60)에 절연성 재료로 이루어지는 슬리브(70)가 삽입되며, 슬리브(70)가 기판(10)의 두께 방향의 상부에서, 접합 수단(80)을 매개로 하여 관통 구멍(60)에 접합되어 있다. An electrostatic chuck device is provided in which the occurrence of cracking in a ceramic layer, the cracking being caused by a difference in thermal expansion between a substrate and a sleeve due to heat generated during formation of the ceramic layer, is suppressed. The electrostatic chuck device includes a substrate, a laminated body that is laminated on the substrate and that includes at least an internal electrode, and a ceramic layer that is laminated on the upper surface of the laminated body in the thickness direction. The electrostatic chuck device is such that the substrate has a through-hole provided so as to pass through in the thickness direction, a sleeve formed from an insulating material is inserted into the through-hole, and the sleeve is joined to the through-hole via a joining means at an upper portion of the substrate in the thickness direction.
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An electrostatic chuck device is provided in which the occurrence of cracking in a ceramic layer, the cracking being caused by a difference in thermal expansion between a substrate and a sleeve due to heat generated during formation of the ceramic layer, is suppressed. The electrostatic chuck device includes a substrate, a laminated body that is laminated on the substrate and that includes at least an internal electrode, and a ceramic layer that is laminated on the upper surface of the laminated body in the thickness direction. The electrostatic chuck device is such that the substrate has a through-hole provided so as to pass through in the thickness direction, a sleeve formed from an insulating material is inserted into the through-hole, and the sleeve is joined to the through-hole via a joining means at an upper portion of the substrate in the thickness direction.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240426&amp;DB=EPODOC&amp;CC=KR&amp;NR=20240055140A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240426&amp;DB=EPODOC&amp;CC=KR&amp;NR=20240055140A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TOCHIHIRA JUN</creatorcontrib><creatorcontrib>HAGIHARA TOMOYA</creatorcontrib><title>ELECTROSTATIC CHUCK DEVICE</title><description>본 발명은, 세라믹스층을 형성할 때에 발생하는 열에 의한 기판과 슬리브의 열팽창의 차이에 기인하여, 세라믹스층에 균열이 생기는 것을 억제한 정전 척 장치를 제공하는 것을 목적으로 한다. 본 발명의 정전 척 장치(1)는, 기판(10)과, 기판(10) 상에 적층된 내부 전극(20)을 적어도 포함하는 적층체(2)와, 적층체(2)의 두께 방향의 상면에 적층된 세라믹스층(50)을 구비하고, 기판(10)은, 두께 방향으로 관통하여 마련된 관통 구멍(60)을 가지고, 관통 구멍(60)에 절연성 재료로 이루어지는 슬리브(70)가 삽입되며, 슬리브(70)가 기판(10)의 두께 방향의 상부에서, 접합 수단(80)을 매개로 하여 관통 구멍(60)에 접합되어 있다. An electrostatic chuck device is provided in which the occurrence of cracking in a ceramic layer, the cracking being caused by a difference in thermal expansion between a substrate and a sleeve due to heat generated during formation of the ceramic layer, is suppressed. The electrostatic chuck device includes a substrate, a laminated body that is laminated on the substrate and that includes at least an internal electrode, and a ceramic layer that is laminated on the upper surface of the laminated body in the thickness direction. 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An electrostatic chuck device is provided in which the occurrence of cracking in a ceramic layer, the cracking being caused by a difference in thermal expansion between a substrate and a sleeve due to heat generated during formation of the ceramic layer, is suppressed. The electrostatic chuck device includes a substrate, a laminated body that is laminated on the substrate and that includes at least an internal electrode, and a ceramic layer that is laminated on the upper surface of the laminated body in the thickness direction. The electrostatic chuck device is such that the substrate has a through-hole provided so as to pass through in the thickness direction, a sleeve formed from an insulating material is inserted into the through-hole, and the sleeve is joined to the through-hole via a joining means at an upper portion of the substrate in the thickness direction.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title ELECTROSTATIC CHUCK DEVICE
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