과립상 경화성 실리콘 조성물, 그의 경화물, 및 그의 제조방법
[과제] 기능성 무기 필러를 대량으로 함유할 수 있고, 고온하에서의 높은 유동성에 의해 특징지어지는 핫멜트성, 갭필성 및 균일성이 우수한 경화물을 부여하는 조성물로서, 트랜스퍼 성형 등의 성형 내지 봉지 프로세스에 적합하게 이용할 수 있으며, 분진이 발생하기 어렵고, 취급 작업성이 우수한 경화성 실리콘 조성물, 그 생산 효율 및 균질성이 우수한 제조방법을 제공한다. [해결 수단] (A) T 단위를 적어도 20 몰% 이상 함유하는 오가노폴리실록산 수지, (B) 경화제, 및 (C) 기능성 무기 필러를 함유하여 이루어지며, (C) 성분의...
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| creator | IMAIZUMI TORU YAMAZAKI RYOSUKE OZAKI KOICHI MATSUSHIMA HIDENORI |
| description | [과제] 기능성 무기 필러를 대량으로 함유할 수 있고, 고온하에서의 높은 유동성에 의해 특징지어지는 핫멜트성, 갭필성 및 균일성이 우수한 경화물을 부여하는 조성물로서, 트랜스퍼 성형 등의 성형 내지 봉지 프로세스에 적합하게 이용할 수 있으며, 분진이 발생하기 어렵고, 취급 작업성이 우수한 경화성 실리콘 조성물, 그 생산 효율 및 균질성이 우수한 제조방법을 제공한다. [해결 수단] (A) T 단위를 적어도 20 몰% 이상 함유하는 오가노폴리실록산 수지, (B) 경화제, 및 (C) 기능성 무기 필러를 함유하여 이루어지며, (C) 성분의 함유량이 (A) 성분과 (B) 성분의 합계 100 질량부에 대해 400~3000 질량부이고, 25℃에서는 고체이고, 180℃에서의 플로 테스터에 의해 측정되는 용융 점도가 200 Pa·s 이하인, 평균 입자 지름이 0.1~10.0 mm의 범위에 있는 과립상 경화성 실리콘 조성물 및 그의 용도.
[Problem]To provide: a curable silicone composition that can contain a large amount of a functional inorganic filler, provides a cured product with excellent hot-melt, gap-filling, and homogeneity properties characterized by high fluidity at high temperatures, is suitable for transfer molding and other molding or sealing processes, generates little dust, and has excellent handling workability; a manufacturing method with excellent production efficiency and homogeneity; and the like.[Solution]A granular curable silicone composition containing (A) an organopolysiloxane resin containing at least 20 mol% or more T units, (B) a curing agent, and (C) a functional inorganic filler, wherein the amount of component (C) is 400 to 3000 parts by mass relative to 100 parts by mass of component (A) and component (B), the composition is a solid at 25°C and has a melt viscosity of 200 Pa·s or less as measured by a flow tester at 180°C, and the average particle size thereof is in the range of 0.1 to 10.0 mm; and an application thereof. |
| format | Patent |
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[Problem]To provide: a curable silicone composition that can contain a large amount of a functional inorganic filler, provides a cured product with excellent hot-melt, gap-filling, and homogeneity properties characterized by high fluidity at high temperatures, is suitable for transfer molding and other molding or sealing processes, generates little dust, and has excellent handling workability; a manufacturing method with excellent production efficiency and homogeneity; and the like.[Solution]A granular curable silicone composition containing (A) an organopolysiloxane resin containing at least 20 mol% or more T units, (B) a curing agent, and (C) a functional inorganic filler, wherein the amount of component (C) is 400 to 3000 parts by mass relative to 100 parts by mass of component (A) and component (B), the composition is a solid at 25°C and has a melt viscosity of 200 Pa·s or less as measured by a flow tester at 180°C, and the average particle size thereof is in the range of 0.1 to 10.0 mm; and an application thereof.</description><language>kor</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240422&DB=EPODOC&CC=KR&NR=20240052022A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240422&DB=EPODOC&CC=KR&NR=20240052022A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IMAIZUMI TORU</creatorcontrib><creatorcontrib>YAMAZAKI RYOSUKE</creatorcontrib><creatorcontrib>OZAKI KOICHI</creatorcontrib><creatorcontrib>MATSUSHIMA HIDENORI</creatorcontrib><title>과립상 경화성 실리콘 조성물, 그의 경화물, 및 그의 제조방법</title><description>[과제] 기능성 무기 필러를 대량으로 함유할 수 있고, 고온하에서의 높은 유동성에 의해 특징지어지는 핫멜트성, 갭필성 및 균일성이 우수한 경화물을 부여하는 조성물로서, 트랜스퍼 성형 등의 성형 내지 봉지 프로세스에 적합하게 이용할 수 있으며, 분진이 발생하기 어렵고, 취급 작업성이 우수한 경화성 실리콘 조성물, 그 생산 효율 및 균질성이 우수한 제조방법을 제공한다. [해결 수단] (A) T 단위를 적어도 20 몰% 이상 함유하는 오가노폴리실록산 수지, (B) 경화제, 및 (C) 기능성 무기 필러를 함유하여 이루어지며, (C) 성분의 함유량이 (A) 성분과 (B) 성분의 합계 100 질량부에 대해 400~3000 질량부이고, 25℃에서는 고체이고, 180℃에서의 플로 테스터에 의해 측정되는 용융 점도가 200 Pa·s 이하인, 평균 입자 지름이 0.1~10.0 mm의 범위에 있는 과립상 경화성 실리콘 조성물 및 그의 용도.
[Problem]To provide: a curable silicone composition that can contain a large amount of a functional inorganic filler, provides a cured product with excellent hot-melt, gap-filling, and homogeneity properties characterized by high fluidity at high temperatures, is suitable for transfer molding and other molding or sealing processes, generates little dust, and has excellent handling workability; a manufacturing method with excellent production efficiency and homogeneity; and the like.[Solution]A granular curable silicone composition containing (A) an organopolysiloxane resin containing at least 20 mol% or more T units, (B) a curing agent, and (C) a functional inorganic filler, wherein the amount of component (C) is 400 to 3000 parts by mass relative to 100 parts by mass of component (A) and component (B), the composition is a solid at 25°C and has a melt viscosity of 200 Pa·s or less as measured by a flow tester at 180°C, and the average particle size thereof is in the range of 0.1 to 10.0 mm; and an application thereof.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAh6tXnP62V73zQ3KrzatPftzClvWjYqvOle8nrZmjd7Zyi8WbgBKPB6zR4dhVfbd7yZOwOqCizyekM_TPTNgjlApa83rHy9aSoPA2taYk5xKi-U5mZQdnMNcfbQTS3Ij08tLkhMTs1LLYn3DjIyMDIxMDAFUkaOxsSpAgBk2lCH</recordid><startdate>20240422</startdate><enddate>20240422</enddate><creator>IMAIZUMI TORU</creator><creator>YAMAZAKI RYOSUKE</creator><creator>OZAKI KOICHI</creator><creator>MATSUSHIMA HIDENORI</creator><scope>EVB</scope></search><sort><creationdate>20240422</creationdate><title>과립상 경화성 실리콘 조성물, 그의 경화물, 및 그의 제조방법</title><author>IMAIZUMI TORU ; YAMAZAKI RYOSUKE ; OZAKI KOICHI ; MATSUSHIMA HIDENORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240052022A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2024</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>IMAIZUMI TORU</creatorcontrib><creatorcontrib>YAMAZAKI RYOSUKE</creatorcontrib><creatorcontrib>OZAKI KOICHI</creatorcontrib><creatorcontrib>MATSUSHIMA HIDENORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IMAIZUMI TORU</au><au>YAMAZAKI RYOSUKE</au><au>OZAKI KOICHI</au><au>MATSUSHIMA HIDENORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>과립상 경화성 실리콘 조성물, 그의 경화물, 및 그의 제조방법</title><date>2024-04-22</date><risdate>2024</risdate><abstract>[과제] 기능성 무기 필러를 대량으로 함유할 수 있고, 고온하에서의 높은 유동성에 의해 특징지어지는 핫멜트성, 갭필성 및 균일성이 우수한 경화물을 부여하는 조성물로서, 트랜스퍼 성형 등의 성형 내지 봉지 프로세스에 적합하게 이용할 수 있으며, 분진이 발생하기 어렵고, 취급 작업성이 우수한 경화성 실리콘 조성물, 그 생산 효율 및 균질성이 우수한 제조방법을 제공한다. [해결 수단] (A) T 단위를 적어도 20 몰% 이상 함유하는 오가노폴리실록산 수지, (B) 경화제, 및 (C) 기능성 무기 필러를 함유하여 이루어지며, (C) 성분의 함유량이 (A) 성분과 (B) 성분의 합계 100 질량부에 대해 400~3000 질량부이고, 25℃에서는 고체이고, 180℃에서의 플로 테스터에 의해 측정되는 용융 점도가 200 Pa·s 이하인, 평균 입자 지름이 0.1~10.0 mm의 범위에 있는 과립상 경화성 실리콘 조성물 및 그의 용도.
[Problem]To provide: a curable silicone composition that can contain a large amount of a functional inorganic filler, provides a cured product with excellent hot-melt, gap-filling, and homogeneity properties characterized by high fluidity at high temperatures, is suitable for transfer molding and other molding or sealing processes, generates little dust, and has excellent handling workability; a manufacturing method with excellent production efficiency and homogeneity; and the like.[Solution]A granular curable silicone composition containing (A) an organopolysiloxane resin containing at least 20 mol% or more T units, (B) a curing agent, and (C) a functional inorganic filler, wherein the amount of component (C) is 400 to 3000 parts by mass relative to 100 parts by mass of component (A) and component (B), the composition is a solid at 25°C and has a melt viscosity of 200 Pa·s or less as measured by a flow tester at 180°C, and the average particle size thereof is in the range of 0.1 to 10.0 mm; and an application thereof.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | 과립상 경화성 실리콘 조성물, 그의 경화물, 및 그의 제조방법 |
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