CMP 슬러리 응집 감소를 위한 사용 지점의 초음파 균질화기

예시적인 슬러리 전달 조립체들은 슬러리 유체 공급원을 포함할 수 있다. 조립체들은 내강 유입구 및 내강 배출구를 갖는 슬러리 전달 내강을 포함할 수 있다. 내강 유입구는 슬러리 유체 공급원의 출력과 유체 결합될 수 있다. 조립체들은, 내강 배출구와 유체 결합된 탈응집관을 포함할 수 있다. 탈응집관은 관 유입구 및 관 배출구를 포함할 수 있다. 조립체들은 탈응집관과 결합된 하나 이상의 초음파 트랜스듀서를 포함할 수 있다. Exemplary slurry delivery assemblies may include a slurry fluid...

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Hauptverfasser:	POLLARD CHAD, SOUNDARARAJAN HARI N, BROWN BRIAN J, CHOU CHIH CHUNG, TANG JIANSHE, WU HAOSHENG, CHANG SHOU SUNG
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Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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creator	POLLARD CHAD SOUNDARARAJAN HARI N BROWN BRIAN J CHOU CHIH CHUNG TANG JIANSHE WU HAOSHENG CHANG SHOU SUNG
description	예시적인 슬러리 전달 조립체들은 슬러리 유체 공급원을 포함할 수 있다. 조립체들은 내강 유입구 및 내강 배출구를 갖는 슬러리 전달 내강을 포함할 수 있다. 내강 유입구는 슬러리 유체 공급원의 출력과 유체 결합될 수 있다. 조립체들은, 내강 배출구와 유체 결합된 탈응집관을 포함할 수 있다. 탈응집관은 관 유입구 및 관 배출구를 포함할 수 있다. 조립체들은 탈응집관과 결합된 하나 이상의 초음파 트랜스듀서를 포함할 수 있다. Exemplary slurry delivery assemblies may include a slurry fluid source. The assemblies may include a flurry delivery lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled with an output of the slurry fluid source. The assemblies may include a deagglomeration tube fluidly coupled with the lumen outlet. The deagglomeration tube may include a tube inlet and a tube outlet. The assemblies may include one or more ultrasonic transducers coupled with the deagglomeration tube.
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Exemplary slurry delivery assemblies may include a slurry fluid source. The assemblies may include a flurry delivery lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled with an output of the slurry fluid source. The assemblies may include a deagglomeration tube fluidly coupled with the lumen outlet. The deagglomeration tube may include a tube inlet and a tube outlet. 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Exemplary slurry delivery assemblies may include a slurry fluid source. The assemblies may include a flurry delivery lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled with an output of the slurry fluid source. The assemblies may include a deagglomeration tube fluidly coupled with the lumen outlet. The deagglomeration tube may include a tube inlet and a tube outlet. 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Exemplary slurry delivery assemblies may include a slurry fluid source. The assemblies may include a flurry delivery lumen having a lumen inlet and a lumen outlet. The lumen inlet may be fluidly coupled with an output of the slurry fluid source. The assemblies may include a deagglomeration tube fluidly coupled with the lumen outlet. The deagglomeration tube may include a tube inlet and a tube outlet. The assemblies may include one or more ultrasonic transducers coupled with the deagglomeration tube.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY MIXING, e.g. DISSOLVING, EMULSIFYING, DISPERSING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
title	CMP 슬러리 응집 감소를 위한 사용 지점의 초음파 균질화기
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