적층체 및 적층체를 구비한 전자 기기
상태 시뿐만 아니라, 장기 내열 시험 후에 있어서도 도금층의 밀착성을 유지할 수 있는 적층체를 제공한다. 지지체와, 상기 지지체 상에, 프라이머층, 금속 입자층 및 금속 도금층을 순차 구비한 적층체로서, 상기 프라이머층이 중량 평균 분자량이 10,000 내지 100,000인 페녹시 수지를 포함하는, 적층체로 한다. Provided is a laminate in which adhesion of a plating layer can be maintained not only when in a normal state, but even aft...
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| creator | SHIRAKAMI JUN HIROTA YOUSUKE FUJIKAWA WATARU TAKIZAWA MASAHIRO |
| description | 상태 시뿐만 아니라, 장기 내열 시험 후에 있어서도 도금층의 밀착성을 유지할 수 있는 적층체를 제공한다. 지지체와, 상기 지지체 상에, 프라이머층, 금속 입자층 및 금속 도금층을 순차 구비한 적층체로서, 상기 프라이머층이 중량 평균 분자량이 10,000 내지 100,000인 페녹시 수지를 포함하는, 적층체로 한다.
Provided is a laminate in which adhesion of a plating layer can be maintained not only when in a normal state, but even after a long heat resistance test. A laminate comprising a support and a primer layer, a metal particle layer, and a metal plating layer provided in the stated order on the support, wherein the primer layer includes a phenoxy resin having a weight-average molecular weight of 10,000 to 100,000. |
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Provided is a laminate in which adhesion of a plating layer can be maintained not only when in a normal state, but even after a long heat resistance test. A laminate comprising a support and a primer layer, a metal particle layer, and a metal plating layer provided in the stated order on the support, wherein the primer layer includes a phenoxy resin having a weight-average molecular weight of 10,000 to 100,000.</description><language>kor</language><subject>ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMICAL PAINT OR INK REMOVERS ; CHEMISTRY ; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; CORRECTING FLUIDS ; DYES ; FILLING PASTES ; GENERAL PROCESSES OF COMPOUNDING ; INKS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PASTES OR SOLIDS FOR COLOURING OR PRINTING ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; USE OF MATERIALS THEREFOR ; WOODSTAINS ; WORKING-UP</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240322&DB=EPODOC&CC=KR&NR=20240037880A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240322&DB=EPODOC&CC=KR&NR=20240037880A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SHIRAKAMI JUN</creatorcontrib><creatorcontrib>HIROTA YOUSUKE</creatorcontrib><creatorcontrib>FUJIKAWA WATARU</creatorcontrib><creatorcontrib>TAKIZAWA MASAHIRO</creatorcontrib><title>적층체 및 적층체를 구비한 전자 기기</title><description>상태 시뿐만 아니라, 장기 내열 시험 후에 있어서도 도금층의 밀착성을 유지할 수 있는 적층체를 제공한다. 지지체와, 상기 지지체 상에, 프라이머층, 금속 입자층 및 금속 도금층을 순차 구비한 적층체로서, 상기 프라이머층이 중량 평균 분자량이 10,000 내지 100,000인 페녹시 수지를 포함하는, 적층체로 한다.
Provided is a laminate in which adhesion of a plating layer can be maintained not only when in a normal state, but even after a long heat resistance test. A laminate comprising a support and a primer layer, a metal particle layer, and a metal plating layer provided in the stated order on the support, wherein the primer layer includes a phenoxy resin having a weight-average molecular weight of 10,000 to 100,000.</description><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMICAL PAINT OR INK REMOVERS</subject><subject>CHEMISTRY</subject><subject>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>CORRECTING FLUIDS</subject><subject>DYES</subject><subject>FILLING PASTES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>INKS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PASTES OR SOLIDS FOR COLOURING OR PRINTING</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><subject>USE OF MATERIALS THEREFOR</subject><subject>WOODSTAINS</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB6s6DxzY6tbzZtUXi9oV8Bznu9dI_Cq61rXu9seTt1DlC45c28CQqvdmwAIh4G1rTEnOJUXijNzaDs5hri7KGbWpAfn1pckJicmpdaEu8dZGRgZGJgYGxuYWHgaEycKgBdQzve</recordid><startdate>20240322</startdate><enddate>20240322</enddate><creator>SHIRAKAMI JUN</creator><creator>HIROTA YOUSUKE</creator><creator>FUJIKAWA WATARU</creator><creator>TAKIZAWA MASAHIRO</creator><scope>EVB</scope></search><sort><creationdate>20240322</creationdate><title>적층체 및 적층체를 구비한 전자 기기</title><author>SHIRAKAMI JUN ; HIROTA YOUSUKE ; FUJIKAWA WATARU ; TAKIZAWA MASAHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20240037880A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>kor</language><creationdate>2024</creationdate><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMICAL PAINT OR INK REMOVERS</topic><topic>CHEMISTRY</topic><topic>COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>CORRECTING FLUIDS</topic><topic>DYES</topic><topic>FILLING PASTES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>INKS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PASTES OR SOLIDS FOR COLOURING OR PRINTING</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><topic>USE OF MATERIALS THEREFOR</topic><topic>WOODSTAINS</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>SHIRAKAMI JUN</creatorcontrib><creatorcontrib>HIROTA YOUSUKE</creatorcontrib><creatorcontrib>FUJIKAWA WATARU</creatorcontrib><creatorcontrib>TAKIZAWA MASAHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SHIRAKAMI JUN</au><au>HIROTA YOUSUKE</au><au>FUJIKAWA WATARU</au><au>TAKIZAWA MASAHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>적층체 및 적층체를 구비한 전자 기기</title><date>2024-03-22</date><risdate>2024</risdate><abstract>상태 시뿐만 아니라, 장기 내열 시험 후에 있어서도 도금층의 밀착성을 유지할 수 있는 적층체를 제공한다. 지지체와, 상기 지지체 상에, 프라이머층, 금속 입자층 및 금속 도금층을 순차 구비한 적층체로서, 상기 프라이머층이 중량 평균 분자량이 10,000 내지 100,000인 페녹시 수지를 포함하는, 적층체로 한다.
Provided is a laminate in which adhesion of a plating layer can be maintained not only when in a normal state, but even after a long heat resistance test. A laminate comprising a support and a primer layer, a metal particle layer, and a metal plating layer provided in the stated order on the support, wherein the primer layer includes a phenoxy resin having a weight-average molecular weight of 10,000 to 100,000.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP |
| title | 적층체 및 적층체를 구비한 전자 기기 |
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