HEAT SPREADER FOR USE WITH A SEMICONDUCTOR DEVICE

A heat spreader can be used with a semiconductor component. The heat spreader comprises: a body having a bottom surface in thermal contact with a semiconductor component and a top surface facing the bottom surface; a plurality of holes disposed in a non-peripheral area of the body, wherein each hole...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PARK YOSEP, PARK SOOHAN, KIM KYUNGEUN, RA INWEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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