SUBSTRATE PROCESSING APPARATUS

The present invention relates to a substrate processing device. The substrate processing device includes a nozzle arm and a side nozzle head installed on the nozzle arm. Therefore, the substrate processing device increases a particle removal rate. 본 발명에 따른 기판처리장치는, 노즐암; 및 상기 노즐암에 설치되어 기판에 약액을 사선으로 토...

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Bibliographische Detailangaben
Hauptverfasser:	HONG YONG HOON, HAN JIN AH, YOON DO HYEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY NOZZLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention relates to a substrate processing device. The substrate processing device includes a nozzle arm and a side nozzle head installed on the nozzle arm. Therefore, the substrate processing device increases a particle removal rate. 본 발명에 따른 기판처리장치는, 노즐암; 및 상기 노즐암에 설치되어 기판에 약액을 사선으로 토출하도록 하방경사지게 형성되며, 횡방향으로 이동가능하도록 상기 노즐암에 이동되게 조립된 사이드노즐헤드;를 포함한다.