Substrate support and substrate processing apparatus including the same
According to an embodiment of the present invention, a substrate support unit comprises: an upper plate that directly or indirectly supports a substrate and is formed of a carbon material; a lower plate installed below the upper plate and made of a carbon material; and a heating element formed betwe...
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| creator | CHO KUK HYUN BANG SEUNG DUK |
| description | According to an embodiment of the present invention, a substrate support unit comprises: an upper plate that directly or indirectly supports a substrate and is formed of a carbon material; a lower plate installed below the upper plate and made of a carbon material; and a heating element formed between the upper plate and the lower plate. The upper plate and the lower plate may be made of materials having different thermal conductivities.
본 발명의 일 실시예에 따른 기판 지지부는, 기판을 직접 또는 간접 지지하고 탄소 소재로 형성되는 상부 플레이트; 상기 상부 플레이트 하부에 설치되고 탄소 소재로 형성되는 하부 플레이트; 및 상기 상부 플레이트와 상기 하부 플레이트 사이에 형성되는 발열체;를 포함하고, 상기 상부 플레이트 및 상기 하부 플레이트는 서로 다른 열전도율을 가지는 재질로 이루어질 수 있다. |
| format | Patent |
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본 발명의 일 실시예에 따른 기판 지지부는, 기판을 직접 또는 간접 지지하고 탄소 소재로 형성되는 상부 플레이트; 상기 상부 플레이트 하부에 설치되고 탄소 소재로 형성되는 하부 플레이트; 및 상기 상부 플레이트와 상기 하부 플레이트 사이에 형성되는 발열체;를 포함하고, 상기 상부 플레이트 및 상기 하부 플레이트는 서로 다른 열전도율을 가지는 재질로 이루어질 수 있다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231109&DB=EPODOC&CC=KR&NR=20230154548A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231109&DB=EPODOC&CC=KR&NR=20230154548A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHO KUK HYUN</creatorcontrib><creatorcontrib>BANG SEUNG DUK</creatorcontrib><title>Substrate support and substrate processing apparatus including the same</title><description>According to an embodiment of the present invention, a substrate support unit comprises: an upper plate that directly or indirectly supports a substrate and is formed of a carbon material; a lower plate installed below the upper plate and made of a carbon material; and a heating element formed between the upper plate and the lower plate. The upper plate and the lower plate may be made of materials having different thermal conductivities.
본 발명의 일 실시예에 따른 기판 지지부는, 기판을 직접 또는 간접 지지하고 탄소 소재로 형성되는 상부 플레이트; 상기 상부 플레이트 하부에 설치되고 탄소 소재로 형성되는 하부 플레이트; 및 상기 상부 플레이트와 상기 하부 플레이트 사이에 형성되는 발열체;를 포함하고, 상기 상부 플레이트 및 상기 하부 플레이트는 서로 다른 열전도율을 가지는 재질로 이루어질 수 있다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAPLk0qLilKLElVKC4tKMgvKlFIzEsBsmGiBUX5yanFxZl56QqJBQWJQLHSYoXMvOSc0hSQWEkGUGNibioPA2taYk5xKi-U5mZQdnMNcfbQTS3Ij08tLkhMTs1LLYn3DjIyMDI2MDQ1MTWxcDQmThUAsVE1qg</recordid><startdate>20231109</startdate><enddate>20231109</enddate><creator>CHO KUK HYUN</creator><creator>BANG SEUNG DUK</creator><scope>EVB</scope></search><sort><creationdate>20231109</creationdate><title>Substrate support and substrate processing apparatus including the same</title><author>CHO KUK HYUN ; BANG SEUNG DUK</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230154548A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>CHO KUK HYUN</creatorcontrib><creatorcontrib>BANG SEUNG DUK</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHO KUK HYUN</au><au>BANG SEUNG DUK</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate support and substrate processing apparatus including the same</title><date>2023-11-09</date><risdate>2023</risdate><abstract>According to an embodiment of the present invention, a substrate support unit comprises: an upper plate that directly or indirectly supports a substrate and is formed of a carbon material; a lower plate installed below the upper plate and made of a carbon material; and a heating element formed between the upper plate and the lower plate. The upper plate and the lower plate may be made of materials having different thermal conductivities.
본 발명의 일 실시예에 따른 기판 지지부는, 기판을 직접 또는 간접 지지하고 탄소 소재로 형성되는 상부 플레이트; 상기 상부 플레이트 하부에 설치되고 탄소 소재로 형성되는 하부 플레이트; 및 상기 상부 플레이트와 상기 하부 플레이트 사이에 형성되는 발열체;를 포함하고, 상기 상부 플레이트 및 상기 하부 플레이트는 서로 다른 열전도율을 가지는 재질로 이루어질 수 있다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Substrate support and substrate processing apparatus including the same |
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