SUBSTRATE HEATING DEVICE AND APPARATUS FOR PROCESSING SUBSTRATE HAVING THE SAME
The present invention relates to a substrate heating device and a substrate processing apparatus having the same, and more specifically, to a substrate heating device used for heating a substrate and a substrate processing apparatus having the same. The substrate heating device according to an embod...
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| creator | KEUM MIN JONG |
| description | The present invention relates to a substrate heating device and a substrate processing apparatus having the same, and more specifically, to a substrate heating device used for heating a substrate and a substrate processing apparatus having the same. The substrate heating device according to an embodiment of the present invention comprises: a substrate support unit for mounting a substrate; and a plurality of heaters provided in a lower part of the substrate support unit and comprising a connection terminal provided on an end portion and a heating element extended from the connection terminal in one direction. The plurality of heaters is alternatingly arranged to cause a partial area containing the end portion is overlapped in a direction crossing the one direction. Accordingly, the substrate heating device can minimize a non-heating area.
본 발명은 기판 가열 장치 및 이를 포함하는 기판 처리 장치에 관한 것으로서, 보다 상세하게는 기판을 가열하기 위하여 사용되는 기판 가열 장치 및 이를 포함하는 기판 처리 장치에 관한 것이다. 본 발명의 실시 예에 따른 기판 가열 장치는, 기판을 안착시키기 위한 기판 지지부; 및 상기 기판 지지부의 하부에 마련되고, 단부에 마련되는 접속 단자 및 상기 접속 단자로부터 일 방향으로 연장되는 발열체를 가지는 복수의 히터;를 포함하고, 상기 복수의 히터는 상기 단부를 포함하는 일부 영역이 상기 일 방향과 교차하는 방향으로 중첩되도록 서로 엇갈리게 배치된다. |
| format | Patent |
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본 발명은 기판 가열 장치 및 이를 포함하는 기판 처리 장치에 관한 것으로서, 보다 상세하게는 기판을 가열하기 위하여 사용되는 기판 가열 장치 및 이를 포함하는 기판 처리 장치에 관한 것이다. 본 발명의 실시 예에 따른 기판 가열 장치는, 기판을 안착시키기 위한 기판 지지부; 및 상기 기판 지지부의 하부에 마련되고, 단부에 마련되는 접속 단자 및 상기 접속 단자로부터 일 방향으로 연장되는 발열체를 가지는 복수의 히터;를 포함하고, 상기 복수의 히터는 상기 단부를 포함하는 일부 영역이 상기 일 방향과 교차하는 방향으로 중첩되도록 서로 엇갈리게 배치된다.</description><language>eng ; kor</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231101&DB=EPODOC&CC=KR&NR=20230151339A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20231101&DB=EPODOC&CC=KR&NR=20230151339A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KEUM MIN JONG</creatorcontrib><title>SUBSTRATE HEATING DEVICE AND APPARATUS FOR PROCESSING SUBSTRATE HAVING THE SAME</title><description>The present invention relates to a substrate heating device and a substrate processing apparatus having the same, and more specifically, to a substrate heating device used for heating a substrate and a substrate processing apparatus having the same. The substrate heating device according to an embodiment of the present invention comprises: a substrate support unit for mounting a substrate; and a plurality of heaters provided in a lower part of the substrate support unit and comprising a connection terminal provided on an end portion and a heating element extended from the connection terminal in one direction. The plurality of heaters is alternatingly arranged to cause a partial area containing the end portion is overlapped in a direction crossing the one direction. Accordingly, the substrate heating device can minimize a non-heating area.
본 발명은 기판 가열 장치 및 이를 포함하는 기판 처리 장치에 관한 것으로서, 보다 상세하게는 기판을 가열하기 위하여 사용되는 기판 가열 장치 및 이를 포함하는 기판 처리 장치에 관한 것이다. 본 발명의 실시 예에 따른 기판 가열 장치는, 기판을 안착시키기 위한 기판 지지부; 및 상기 기판 지지부의 하부에 마련되고, 단부에 마련되는 접속 단자 및 상기 접속 단자로부터 일 방향으로 연장되는 발열체를 가지는 복수의 히터;를 포함하고, 상기 복수의 히터는 상기 단부를 포함하는 일부 영역이 상기 일 방향과 교차하는 방향으로 중첩되도록 서로 엇갈리게 배치된다.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPAPDnUKDglyDHFV8HB1DPH0c1dwcQ3zdHZVcPRzUXAMCHAEyoUGK7j5BykEBPk7uwYHg9Qg6XIMAwmEeLgqBDv6uvIwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUknjvICMDI2MDQ1NDY2NLR2PiVAEABiovog</recordid><startdate>20231101</startdate><enddate>20231101</enddate><creator>KEUM MIN JONG</creator><scope>EVB</scope></search><sort><creationdate>20231101</creationdate><title>SUBSTRATE HEATING DEVICE AND APPARATUS FOR PROCESSING SUBSTRATE HAVING THE SAME</title><author>KEUM MIN JONG</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_KR20230151339A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; kor</language><creationdate>2023</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>KEUM MIN JONG</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KEUM MIN JONG</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE HEATING DEVICE AND APPARATUS FOR PROCESSING SUBSTRATE HAVING THE SAME</title><date>2023-11-01</date><risdate>2023</risdate><abstract>The present invention relates to a substrate heating device and a substrate processing apparatus having the same, and more specifically, to a substrate heating device used for heating a substrate and a substrate processing apparatus having the same. The substrate heating device according to an embodiment of the present invention comprises: a substrate support unit for mounting a substrate; and a plurality of heaters provided in a lower part of the substrate support unit and comprising a connection terminal provided on an end portion and a heating element extended from the connection terminal in one direction. The plurality of heaters is alternatingly arranged to cause a partial area containing the end portion is overlapped in a direction crossing the one direction. Accordingly, the substrate heating device can minimize a non-heating area.
본 발명은 기판 가열 장치 및 이를 포함하는 기판 처리 장치에 관한 것으로서, 보다 상세하게는 기판을 가열하기 위하여 사용되는 기판 가열 장치 및 이를 포함하는 기판 처리 장치에 관한 것이다. 본 발명의 실시 예에 따른 기판 가열 장치는, 기판을 안착시키기 위한 기판 지지부; 및 상기 기판 지지부의 하부에 마련되고, 단부에 마련되는 접속 단자 및 상기 접속 단자로부터 일 방향으로 연장되는 발열체를 가지는 복수의 히터;를 포함하고, 상기 복수의 히터는 상기 단부를 포함하는 일부 영역이 상기 일 방향과 교차하는 방향으로 중첩되도록 서로 엇갈리게 배치된다.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | SUBSTRATE HEATING DEVICE AND APPARATUS FOR PROCESSING SUBSTRATE HAVING THE SAME |
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