METHOD FOR ADJUSTING PROCESSING POINT POWER IN AN APERTURE ATTACHED TO A PRINTED CIRCUIT BOARD LASER PROCESSING MACHINE AND PRINTED CIRCUIT BOARD LASER PROCESSING MACHINE FOR IMPLEMENTING THEREOF

An objective of the present invention is to provide a method for adjusting a zoom ratio of a zoom using correction parameters based on the difference in machining spot power when using a standard aperture and an assembly aperture to match the machining spot power of both apertures. The method for ad...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	HATA IZUMI, KANAYA YASUHIKO, TATEISHI HIDENORI, KITA YASUHIKO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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