필름상 접착제 및 그 제조 방법, 다이싱·다이본딩 일체형 필름 및 그 제조 방법, 및 반도체 장치 및 그 제조 방법

본 개시에서는, 반도체 장치가 제공된다. 당해 반도체 장치는, 반도체 칩과, 반도체 칩을 탑재하는 지지 부재와, 반도체 칩 및 지지 부재의 사이에 마련되며, 반도체 칩과 지지 부재를 접착하는 접착 부재를 구비한다. 접착 부재는, 은 입자의 소결체를 포함한다. The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor c...

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Hauptverfasser:	KAMONO MEGUMI, TANIGUCHI KOHEI, AKIYAMA YUYA, ITAGAKI KEI, HIRAMOTO YUYA
Format:	Patent
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Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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creator	KAMONO MEGUMI TANIGUCHI KOHEI AKIYAMA YUYA ITAGAKI KEI HIRAMOTO YUYA
description	본 개시에서는, 반도체 장치가 제공된다. 당해 반도체 장치는, 반도체 칩과, 반도체 칩을 탑재하는 지지 부재와, 반도체 칩 및 지지 부재의 사이에 마련되며, 반도체 칩과 지지 부재를 접착하는 접착 부재를 구비한다. 접착 부재는, 은 입자의 소결체를 포함한다. The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor chip mounted thereon; and a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member. The bonding adhesive member includes a sintered body of silver particles.
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The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor chip mounted thereon; and a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member. 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The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor chip mounted thereon; and a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member. 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The present disclosure provides a semiconductor device. The semiconductor device includes a semiconductor chip; a support member having the semiconductor chip mounted thereon; and a bonding adhesive member provided between the semiconductor chip and the support member and adhering the semiconductor chip and the support member. The bonding adhesive member includes a sintered body of silver particles.</abstract><oa>free_for_read</oa></addata></record>
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subjects	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
title	필름상 접착제 및 그 제조 방법, 다이싱·다이본딩 일체형 필름 및 그 제조 방법, 및 반도체 장치 및 그 제조 방법
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